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材料导报  2021, Vol. 35 Issue (8): 8134-8139    https://doi.org/10.11896/cldb.20030054
  金属与金属基复合材料 |
CeO2对Ag30CuZnSn药芯银钎料润湿性能及钎焊接头组织与性能的影响
浦娟1,2,3, 薛松柏1, 张雷2, 吴铭方2, 龙伟民4, 王水庆5, 钱似舰5, 林铁松3
1 南京航空航天大学材料科学与技术学院,南京 210016
2 江苏科技大学材料科学与工程学院,镇江 212003
3 哈尔滨工业大学,先进焊接与连接国家重点实验室,哈尔滨 150001
4 郑州机械研究所,新型钎焊材料与技术国家重点实验室,郑州 450001
5 浙江新锐焊接科技股份有限公司,绍兴 312400
Effect of CeO2 on Wettability of Ag30CuZnSn Flux Cored Brazing Filler Metal and Microstructure and Properties of Brazed Joint
PU Juan1,2,3, XUE Songbai1, ZHANG Lei2, WU Mingfang2, LONG Weimin4, WANG Shuiqing5, QIAN Sijian5, LIN Tiesong3
1 College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
2 College of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
3 State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
4 State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
5 Zhejiang Xinrui Welding Technology Co., Ltd, Shaoxing 312400, China
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摘要 向Ag30CuZnSn药芯银钎料中添加CeO2,研究CeO2对Ag30CuZnSn药芯银钎料的润湿铺展性能和钎焊接头性能的影响,探索CeO2对药芯银钎料润湿铺展性能和钎缝组织的作用机理。研究结果表明:药芯钎剂粉末中加入CeO2能提高Ag30CuZnSn药芯银钎料的润湿铺展性能,CeO2添加量达到0.3%(质量分数,下同)时,对药芯银钎料的改进效果最佳。理论分析认为这是因为高价态的CeO2具有氧化作用,可与T2紫铜表面的Cu2O发生氧化反应生成CuO和Ce2O3。同时,CuO、Cu2O与CeO2、Ce2O3及钎剂中的B2O3生成CuO·Ce2O3·B2O3等盐类,促进了去膜反应的进行,从而提高了银钎料在紫铜板表面的润湿铺展性能。药芯钎剂粉末中添加过量CeO2时,熔点较高的CeO2反而增加了液态钎剂的粘度,未参与反应的CeO2会阻碍熔融钎剂的铺展,进而阻挡熔化的Ag30CuZnSn银钎料在T2紫铜表面的润湿铺展。CeO2作为高熔点氧化物,加入钎剂中后既能起到形核质点的作用,又能作为界面活性剂去除氧化膜。因此,火焰钎焊时,CeO2能细化Ag30CuZnSn药芯银钎料钎焊接头的钎缝组织,当CeO2添加量达到0.3%时,细化效果最佳。钎缝组织的细化使得钎焊接头抗剪强度提高了10%以上,钎焊接头断口组织的形貌和变化规律印证了上述结果。
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浦娟
薛松柏
张雷
吴铭方
龙伟民
王水庆
钱似舰
林铁松
关键词:  CeO2粉末  Ag30CuZnSn药芯银钎料  润湿铺展性能    
Abstract: CeO2 powders were added into Ag30CuZnSn flux cored brazing filler metal. Effect of CeO2 on wettability, microstructure and properties of brazed joint were studied. The roles of CeO2 on the wettability, the microstructure of brazed joints were explored. The results showed that CeO2 addition can improve the wettability. When the content of CeO2 was 0.3wt%, the improvement effect reached the optimum. Theoretical analysis showed that CeO2 can react with Cu2O on the surface of T2 copper to form CuO and Ce2O3. Then CuO, Cu2O and CeO2, Ce2O3 reacted with B2O3 in flux to form CuO·Ce2O3·B2O3 and so on. These promoted the wettability by oxide film removal. When the amount of CeO2 was excessive, the viscosity of the liquid flux was increased due to its high melting point. CeO2 which was not involved in the reaction, will hinder the fluidity of molten flux and then hinder the spreading of molten metals on the surface of T2 copper. CeO2 as an oxide with high melting point, not only played the role of nucleating particle, but also acted as the interfacial activity agent. Therefore, during flame brazing, CeO2 can refine the microstructure of brazed joints. When the addition of CeO2 was 0.3wt%, the refining effect reached the best. The shear strength of brazed joint was increased by more than 10% due to the refinement of brazed joint microstructures. These results were confirmed by the fracture morphologies of brazed joints and the transformation law.
Key words:  CeO2 powders    Ag30CuZnSn flux cored brazing filler metal    wettability
               出版日期:  2021-04-25      发布日期:  2021-05-10
ZTFLH:  TG425  
基金资助: 先进焊接与连接国家重点实验室开放课题研究基金资助项目(AWJ-21M15);江苏科技大学本科生创新计划;江苏省先进焊接技术重点实验室
通讯作者:  pu_juan84@163.com   
作者简介:  浦娟,江苏科技大学副教授。2016年12月毕业于华中科技大学获得材料加工工学博士学位。主要从事先进焊接技术工作,重点研究焊接冶金等。在国内外重要期刊发表文章10多篇,申报发明专利5 项,获江苏省高层次创新创业人才引进计划“科技副总”;还获得了省科技进步二等奖。
引用本文:    
浦娟, 薛松柏, 张雷, 吴铭方, 龙伟民, 王水庆, 钱似舰, 林铁松. CeO2对Ag30CuZnSn药芯银钎料润湿性能及钎焊接头组织与性能的影响[J]. 材料导报, 2021, 35(8): 8134-8139.
PU Juan, XUE Songbai, ZHANG Lei, WU Mingfang, LONG Weimin, WANG Shuiqing, QIAN Sijian, LIN Tiesong. Effect of CeO2 on Wettability of Ag30CuZnSn Flux Cored Brazing Filler Metal and Microstructure and Properties of Brazed Joint. Materials Reports, 2021, 35(8): 8134-8139.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.20030054  或          http://www.mater-rep.com/CN/Y2021/V35/I8/8134
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