Research Status and Prospect of Au-based Medium-Low TemperatureFiller Metals
LIU Han1, XUE Songbai1, WANG Liujue1, LIN Yaowei2, CHEN Hongneng2
1 College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016; 2 Shanwei Source Advanced Materials Corporation, Shanwei 516600
Abstract: As fast development of electronic packaging technology and the inevitable trend of lead-free soldering, a number of alloys have been proposed as alternative Pb-free solders, but in the field of microelectronic and optoelectronic packages, high priced Au-based solder (such as Au-Sn, Au-Si, Au-Ge) is considered as the best one to substitute for high-Pb solders due to their excellent comprehensive properties. However, with the development of high-integration and high-power electronic devices, Au-based low-temperature solders with melting point below 400 ℃ can not fully meet the packaging requirements. It is urgent to develop mid-temperature filler metals with melting point between 400 ℃ and 600 ℃. At pre-sent, among all filler metals with melting points in the range of 280—600 ℃, Au-based alloy systems are the main choice for high-temperature bonding applications in the electronic packaging, or even the only choice. Au-based filler metals have superior resistance to corrosion, high electrical and thermal conductivity, excellent mechanical strength and high reliability, while they are difficult to be processed due to their high brittleness. Processing difficulty, low yield and poor product performance seriously affect the application of Au-based solders. What’s more, the Au content in Au-based alloys is generally so high that the use-cost of Au-based solders is high. Therefore, researchers not only studied the processing technology of brittle solders, but also made a lot of explorations in replacing Au with alloying elements and developing new Au-based alloy systems. The casting drawing and rolling method, laminate-rolling process, roll rapid solidification method and the electroplating deposition method were developed to solve the processing problem caused by the high brittleness of the Au-based alloys. Alloy foils with thickness less than 0.1 mm can be worked out by means of using these processes. The effect of alloying elements on Au-based solders shows that low melting point alloying elements (e.g. Sn, Sb, In) can reduce the melting point of Au-Ge solder, and the ductility of Au-Ge solder is enhanced by adding a small amount of Sb. Sb and Sn can also inhibit excessive growth of interfacial reaction layer. Among many gold-based alloy systems, alloys like Au-Ag-Si, Au-Ag-Ge, Au-In, and Au-Ga have been proposed as medium-temperature solders. Although these alloys are brittle and cannot be processed by conventional methods, they have great potential for being widely used in advanced electronic packaging owing to their excellent wettability and good mechanical properties. This review offers a retrospection of the research efforts with respect to Au-based medium-low temperature filler metals. The properties, characteristics, application fields and influence of alloying elements of Au-based medium-low temperature filler metals are introduced. The various processing methods and their advantages and disadvantages of high-brittle Au-based medium-low temperature filler metals are summarized. The performance and characteristics of Au-Ag, Au-In and Au-Ga medium-temperature filler metals are analyzed and compared emphatically. Based on the existing literature, the development direction of Au-based medium-low temperature filler metals is predicted.
刘晗, 薛松柏, 王刘珏, 林尧伟, 陈宏能. 金基中低温钎料的研究现状与展望[J]. 材料导报, 2019, 33(19): 3189-3195.
LIU Han, XUE Songbai, WANG Liujue, LIN Yaowei, CHEN Hongneng. Research Status and Prospect of Au-based Medium-Low TemperatureFiller Metals. Materials Reports, 2019, 33(19): 3189-3195.
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