Abstract: Recently, lead-free solders have received considerable attention in electronic industry. However, only a small proportion of significant research relates to solders in high temperature environment. For lead-free solders with melting temperature in the range of 280—400 ℃, Au-Ge, Au-Sn, Au-Si and other Au-based solders have gradually replaced the traditional high lead solders and are widely used in the filed of microelectronic packages. Au-Ge alloy has the advantages of good conductivity, thermal conductivity, corrosion resistance and high tensile strength. What’ more, the high-temperature resistant performance of Au-Ge solder is obviously better than that of Au-Sn, Au-Si solders, especially suitable for the high temperature environment. Nonetheless, there are some shortcomings of Au-Ge solder, which seriously affect its production, application and popularization. On the one hand, Au-Ge solder is difficult to be machined due to the existence of Ge, which critically affects its application. On the other hand, excessive Au content in Au-Ge solder leads to its high cost. Consequently, researchers add appropriate alloy elements to modify Au-Ge filler metal and try to develop Au-Ge ternary alloys system. Researchers found that the method of horizontal continuous casting can eliminate machining process and directly produce the desired diameter to solve the processing problem caused by the high brittleness of the Au-Ge alloy. In addition to the study of Au-Ge binary alloy, researchers have also carried out that of Au-Ge-X ternary alloys system. The research shows that the addition of low melting point elements, such as Sn, Sb, and In, can effectively reduce the melting point of solder and meet the quality requirements. Compared with Au-12Ge alloy, the addition of Sn and Sb elements can not only reduce the melting temperature and maintain good wettability, but also inhibit the excessive growth of the interface layer. Among them, appropriate Sn element can also inhibit the coarseness of Ge grains. Sb element can increase the extensibility of Au-Ge solder. Au-Ge-Ni alloy can form ohmic contact with GaAs, which will increases the resistance of the solder bulk. Besides, Au-Ge-Ni solder can form “equal resistance” between soldering seam and base metal to play a better role in bonding. However, if excessive Ni is added to Au-12Ge alloy, coarse GeNi compounds will be formed. After agglomeration, the particles will become large and unevenly distributed, which will seriously affect the strength of joints. The addition of In, Sb elements to Au-Ge solder can also play a role in grain refinement. Up to now, the study of Au-Ge ternary alloys is insufficient and further research on the wettability, mechanical properties and solder joint reliability are need to be carried out to promote its application. In this paper, the research status of Au-Ge based ternary alloys was summarized and introduced. What’s more, the effects of Sn, Ni, In, Sb elements on the properties and microstructures of Au-Ge solder were analyzed. On the basis of summing up the existing literature, this paper looked forward to the general development process and future development direction of Au-Ge based ternary alloys, pointing out the existing problems and solutions.
王子伊, 薛松柏, 王剑豪, 刘晗, 温丽. 添加合金元素改善Au-Ge钎料组织及性能的研究进展[J]. 材料导报, 2020, 34(23): 23145-23153.
WANG Ziyi, XUE Songbai, WANG Jianhao, LIU Han, WEN Li. Research Progress of Adding Alloying Elements to Improve the Microstructure and Properties of Au-Ge Solder. Materials Reports, 2020, 34(23): 23145-23153.
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