1 School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou 221116 2 State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001
Abstract: Soldering technology is widely used in the field of electronic packaging to enable interconnection between electronic packaging devices and materials. SnPb solder has been a commonly used brazing material in the field of electronic packaging due to its good wetting properties, solderability and suitable price. However, Pb is an element that causes harm to the human body and the environment. With the increasing awareness of environmental protection, the use of lead has been greatly restricted. The replacement of SnPb solder by lead-free solder is an inevitable trend in the development of solder, accelerating the lead-free process of soldering technology. When brazing, the performance of the flux determines the efficiency and quality of the solder, so choosing the right flux is key. At present, domestic and foreign research scholars have done a lot of research on lead-free soldering, and have achieved rich results, such as the development of a variety of new lead-free solder by alloying, particle strengthening and other methods; the United States, Japan and Europe have released development guide for lead-free solder and lead-free soldering; development of a variety of lead-free no-clean fluxes. Therefore, basic research and application development systems based on soldering technology have matured. There are three widely used soldering techniques, including wave soldering, reflow soldering, and semiconductor laser soldering.Wave soldering is generally used in hybrid assembly, and reflow soldering is mainly used in surface mount. Semiconductor laser welding as a group welding process is often applied to soldering electronic components and assembly of chip components on a printed circuit board. With the gradual development of electronic products in the direction of miniaturization and multi-functionality, the requirements for connection reliability are getting higher and higher, but the research and application development based on sol-dering technology is still insufficient. In this paper, the research progress and development direction of soldering technology are discussed for the lead-free soldering technology of selectronic packaging. First, introduce the types and composition of lead-free solders and fluxes. Then, for the problem of the interface reaction between Sn and Cu brought by lead-free, three kinds of solutions for substrate alloying, annealing treatment and electroless plating are proposed through Cu substrate. Finally, the reflow, wave soldering and semiconductor laser welding and their applications are elaborated, which provides a further theoretical basis for the study of lead-free soldering technology for electronic packaging.
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2019, Vol. 33 
