Research Progress of Micro-Alloying Sn-Cu Based Lead-Free Solders
FAN Jianglei1, 2, LIU Zhanyun1, LI Yuwen1, WU Shen1, WANG Xiao3, LIU Jianxiu1
1 Institute of Mechanical and Electrical Engineering, Zhengzhou University of Light Industry, Zhengzhou 450002; 2 Henan Key Laboratory of Mechanical Equipment Intelligent Manufacturing, Zhengzhou University of Light Industry, Zhengzhou 450002; 3 School of Energy and Power Engineering, Zhengzhou University of Light Industry, Zhengzhou 450002
Abstract: The environmental protection need of electronic products has promoted the development of lead-free solder alloys in the field of electronic assembly. At present, Sn-Cu based solder is one of the most promising lead-free solders with excellent performa-nces and lower cost. However, the higher melting point, poorer spreading and soldering properties of Sn-Cu based solder on Cu substrate compared with the Sn-Pb solder limit its extensive application. The microstructure and welding performance of Sn-Cu alloy can be improved by adding various alloying elements. Therefore, in this paper, the effects of micro-alloying on the microstructure, wettability and mechanical properties of Sn-Cu based lead-free solders are systematically reviewed. Then,the problems of the alloying for Sn-Cu based solder are pointed out. The development direction and foreground of Sn-Cu based lead-free solders are also discussed.
樊江磊, 刘占云, 李育文, 吴深, 王霄, 刘建秀. Sn-Cu系无铅钎料微合金化研究进展[J]. 材料导报, 2018, 32(21): 3774-3779.
FAN Jianglei, LIU Zhanyun, LI Yuwen, WU Shen, WANG Xiao, LIU Jianxiu. Research Progress of Micro-Alloying Sn-Cu Based Lead-Free Solders. Materials Reports, 2018, 32(21): 3774-3779.
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2018, Vol. 32 
