Thermal Boundary Conductance of a New Generation of High Thermal Conductivity Metal Matrix Composites: A Review
CHANG Guo1, DUAN Jialiang1, WANG Luhua1, WANG Xitao2, ZHANG Hailong1
1 State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083; 2 Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083
Abstract: Thermal boundary resistance(TBC) exists at interface sandwiched between two materials with different physical properties. The TBC greatly affects the heat transfer and largely determines the thermal properties of the composites. Diamond particles reinforced metal matrix composites (MMCs) give full play to the advantages of high thermal conductivity and low thermal expansion coefficient of diamond, and it has the potential to achieve a high thermal conductivity and a thermal expansion coefficient compa-tible with semiconductor. This can meet the ever-increasing demands of cooling capacity of modern electronic devices. Consequently, MMCs have attracted widespread concern as a new generation of electronic packaging materials. TBC(the reciprocal of thermal boundary resistance) is a key factor in determining the heat conduction ability of composite. In addition, the TBC is difficult to deal with since the preparation process of composite, interface modification methods (metal matrix alloying or diamond surface metallization) and modifying metal species can all have an effect. In this paper, the latest achievements in both theoretical and experimental researches of TBC are discussed. Meanwhile, the main questions faced in the investigation of diamond/metal composites are also proposed.
常国,段佳良,王鲁华,王西涛,张海龙. 新一代高导热金属基复合材料界面热导研究进展*[J]. 《材料导报》期刊社, 2017, 31(7): 72-78.
CHANG Guo, DUAN Jialiang, WANG Luhua, WANG Xitao, ZHANG Hailong. Thermal Boundary Conductance of a New Generation of High Thermal Conductivity Metal Matrix Composites: A Review. Materials Reports, 2017, 31(7): 72-78.
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