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《材料导报》期刊社  2018, Vol. 32 Issue (3): 443-452    https://doi.org/10.11896/j.issn.1005-023X.2018.03.015
     材料综述 ｜ |
高导热金刚石/铜复合材料界面修饰研究进展
张晓宇1,2,许旻1,曹生珠1,2
1 兰州空间技术物理研究所,兰州 730000
2 真空技术与物理国防科技重点实验室,兰州 730000
Research Progress on Interfacial Modification of Diamond/Copper Composites with High Thermal Conductivity
Xiaoyu ZHANG1,2,Min XU1,Shengzhu CAO1,2
1 Lanzhou Institute of Physics, Lanzhou 730000
2 Science and Technology on Vacuum Technology andPhysics Laboratory, Lanzhou 730000
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摘要 

界面结合良好的金刚石/铜复合材料具有优异的热物理性能。通过各种手段修饰金刚石-铜界面能够充分发挥金刚石/铜复合材料的高导热潜力。综述了制备金刚石/铜复合材料时主要的两类界面修饰方法:金刚石表面预镀碳化物形成元素和对铜基体预合金化,并对这两类修饰手段的制备工艺和导热机制进行了简单评述。探讨了金刚石/铜复合材料制备及界面修饰领域目前存在的问题及发展趋势。
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张晓宇
许旻
曹生珠
关键词:  金刚石/铜复合材料  界面修饰  热导率  金属基复合材料    
Abstract: 

Diamond/copper composites with well-bonded interface have excellent thermophysical properties. Modified by various means, the diamond-copper interface can sufficiently enhance the thermal conductivity of diamond/copper composites. In this paper, recent progress about two main kinds of interfacial modification methods to prepare diamond/copper composite was reviewed, respectively as the preplating of carbide forming elements on diamond surface and pre-alloying of copper substrate. Preparation process and thermal conduction mechanism of these two modification methods were introduced briefly. The existing problems and development trend of diamond/copper composite preparation and interface modification were discussed.
Key words:  diamond/copper composites    interface modification    thermal conductivity    metal matrix composites
               出版日期:  2018-02-10      发布日期:  2018-02-10
ZTFLH:  TB333  
作者简介:  张晓宇:男,1988年生,博士研究生,主要从事高导热复合材料的研究 E-mail: zhangxiaoyu31@163.com|许旻:通信作者,男,1971年生,研究员,主要从事航天热控材料的研究 E-mail: xmsurface@126.com
引用本文:    
张晓宇,许旻,曹生珠. 高导热金刚石/铜复合材料界面修饰研究进展[J]. 《材料导报》期刊社, 2018, 32(3): 443-452.
Xiaoyu ZHANG,Min XU,Shengzhu CAO. Research Progress on Interfacial Modification of Diamond/Copper Composites with High Thermal Conductivity. Materials Reports, 2018, 32(3): 443-452.
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http://www.mater-rep.com/CN/10.11896/j.issn.1005-023X.2018.03.015  或          http://www.mater-rep.com/CN/Y2018/V32/I3/443
  
  
  
  
  
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