Effect of Curing Agent on the Spreading Property of Sn-58Bi Resin-based Solder Paste
XUE Songbai1, LIU Siyi1, LIU Lu1, ZHONG Sujuan2, LONG Weimin2
1 College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China 2 State Key Laboratory of Advanced Brazing Filler Metals and Technology (Zhengzhou Research Institute of Mechanical Engineering Co., Ltd), Zhengzhou 450002, China
Abstract: The commercially available Sn-58Bi solder paste was taken as a research object and E51 type epoxy resin was added, the Sn-58Bi resin-based solder paste with different curing agents were prepared. The wettability of different kinds of solder pastes were compared. The DSC and FT-IR analysis were used to explore the activity of curing agents and the functional groups of curing products. The results showed that the solder paste with m-phenylenediamine as curing agent has been cured within 4 h at room temperature. The anti-wetting and non-wetting pheno-menon occurred in the spreading process when no curing agent or 593 curing agent, 651 curing agent, methyltetrahydrophthalic anhydride curing agent was used as curing agent of solder paste, while triethanolamine and DMP-30 can keep and promote the wettability of solder paste. Among them, the addition of triethanolamine curing agent increased the spreading area of solder paste by 17.66% on the basis of good curing and for-ming morphology. DSC test results showed that the high-active curing agent in the solder paste caused none wetting phenomenon. FT-IR analysis showed that the amine and carboxylic acid containing in the paste as well as the addition type curing agent will be consumed by the curing reaction, which reduced the flux activity and caused anti-wetting phenomenon. Tertiary amines can act as active agents and will not be consumed by the curing reaction, thus inhibiting anti-wetting and improving wettability.
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2020, Vol. 34 
