Abstract: In order to solve the problem of short service life of Ag-coated Mo interconnects for solar cell of spacecraft due to atomic oxygen erosion, pure Mo was soldered with low temperature Sn-based solder under atmospheric environment, 300 ℃ and without flux by adding active Al element and applying ultrasonic activation soldering method. The effect of Al content in Sn-based solders on the microstructure, element distribution at interface and mechanical properties of ultrasonic soldered Mo joints was studied. The results showed that the interfacial bonding strength was low and the joint fractured from the interface without Al element in the filler metal. With the increase of Al content in the filler metal, the segregation of Al element at the interface increases, the interfacial compound changes from Al5Mo to Al12Mo, and the shear strength of the joint increases gra-dually. When the Al content was 10%, the shear strength of the joint reached 33.36 MPa, and the joint fractured from the soldering seam.
薛海涛, 魏鑫, 郭卫兵, 张新宇. 活性元素Al对超声波钎焊Mo接头组织和力学性能的影响规律[J]. 材料导报, 2020, 34(20): 20103-20106.
XUE Haitao, WEI Xin, GUO Weibing, ZHANG Xinyu. Effect of Active Element Al on Microstructure and Mechanical Properties of Ultrasonic Soldered Mo Joints. Materials Reports, 2020, 34(20): 20103-20106.
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