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材料导报  2023, Vol. 37 Issue (19): 22010113-11    https://doi.org/10.11896/cldb.22010113
  金属与金属基复合材料 |
电子封装用纳米复合焊膏的研究进展
杜伟, 强军锋, 余竹焕*, 高炜, 阎亚雯, 王晓慧, 刘旭亮
西安科技大学材料科学与工程学院,西安 710054
Research Progress of Composite Nanosolders for Electronic Packaging
DU Wei, QIANG Junfeng, YU Zhuhuan*, GAO Wei, YAN Yawen, WANG Xiaohui, LIU Xuliang
College of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China
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摘要 焊料作为焊接工艺的核心,在电子封装器件与材料的互连中扮演着重要角色。随着第三代功率半导体器件的发展,迫使电子封装材料向高功率密度、高服役温度和高可靠性的方向发展。纳米复合焊膏凭借其低温烧结、高温服役和优越的导电性能成为未来电子封装互连材料领域重要的研究方向。本文综合阐述了纳米复合焊膏的研究进展,重点介绍了目前纳米复合焊膏的三种制备方法;归纳整理了Sn-Ag-Cu、Sn-Cu、Ag-Cu、Sn-Zn和Sn-Ag几种不同类型的纳米复合焊膏,并总结了焊膏微观组织、熔化特性、润湿性、导电性、力学性能和可靠性的影响机理;指出了目前纳米复合焊膏的不足之处,并对其发展趋势以及研究前景进行了分析和展望,以期能够为日后研发更高性能的纳米复合焊膏提供一定的理论参考。
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杜伟
强军锋
余竹焕
高炜
阎亚雯
王晓慧
刘旭亮
关键词:  纳米复合焊膏  电化学沉积法  微乳法  液相化学还原法  显微组织  可靠性    
Abstract: As the key of the welding process, solders play an important role in the interconnection between electronic packaging devices and materials. The electronic packaging materials are forced to develop in the direction of high power density, high service temperature and high reliability as the demands of new generation power devices increase. Composite nanosolders have shown good prospects due to their low-temperature sintering, high-temperature service, and excellent electrical conductivity. In this paper, a review of current research on composite nanosolders is presented. Characteristics between the three methods used to prepare composite nanosolders are first discussed. Thereafter, the effective mec-hanism of composite nanosolders on the microstructure and properties are discussed for Sn-Ag-Cu, Sn-Cu, Ag-Cu, Sn-Zn, and Sn-Ag composite nanosolders. Finally, the limitations and developmental research trends of composite nanosolders are summarized as a reference for the future investigation of composite nanosolders with improved performance.
Key words:  composite nanosolder    electrochemical deposition    microemulsion method    aqueous chemical reduction    microstructure    reliability
出版日期:  2023-10-10      发布日期:  2023-09-28
ZTFLH:  TG42  
基金资助: 西安科技大学优秀青年科技基金项目(2018YQ2-12);凝固技术国家重点实验室开放课题(SKLSP201846);陕西省留学人员科技活动择优资助项目(201847)
通讯作者:  *余竹焕,发表被SCI、EI收录论文23篇。西安科技大学材料科学与工程学院副教授、硕士研究生导师。2011年3月在西北工业大学材料科学与工程学院取得博士学位,2015.07-2016.07在美国加州州立大学在进行访问学者研究工作。先后主持了国家自然基金青年项目,留学人员科技活动择优资助项目,陕西省自然科学基础研究计划项目,凝固技术国家重点实验室开放课题项目,陕西省教育厅专项科研计划项目。主要从事高温结构材料的研究工作。 yzh0709qyy@xust.edu.cn   
作者简介:  杜伟,2021年毕业于西安科技大学,获得工学学士学位。现为西安科技大学材料与工程学院硕士研究生,在余竹焕教授的指导下进行研究。目前主要研究方向为微电子封装材料与技术。
引用本文:    
杜伟, 强军锋, 余竹焕, 高炜, 阎亚雯, 王晓慧, 刘旭亮. 电子封装用纳米复合焊膏的研究进展[J]. 材料导报, 2023, 37(19): 22010113-11.
DU Wei, QIANG Junfeng, YU Zhuhuan, GAO Wei, YAN Yawen, WANG Xiaohui, LIU Xuliang. Research Progress of Composite Nanosolders for Electronic Packaging. Materials Reports, 2023, 37(19): 22010113-11.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.22010113  或          http://www.mater-rep.com/CN/Y2023/V37/I19/22010113
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