Abstract: As the key of the welding process, solders play an important role in the interconnection between electronic packaging devices and materials. The electronic packaging materials are forced to develop in the direction of high power density, high service temperature and high reliability as the demands of new generation power devices increase. Composite nanosolders have shown good prospects due to their low-temperature sintering, high-temperature service, and excellent electrical conductivity. In this paper, a review of current research on composite nanosolders is presented. Characteristics between the three methods used to prepare composite nanosolders are first discussed. Thereafter, the effective mec-hanism of composite nanosolders on the microstructure and properties are discussed for Sn-Ag-Cu, Sn-Cu, Ag-Cu, Sn-Zn, and Sn-Ag composite nanosolders. Finally, the limitations and developmental research trends of composite nanosolders are summarized as a reference for the future investigation of composite nanosolders with improved performance.
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