Research Progress in the Preparation and Interface Modification of High Thermal Conductivity Diamond/Copper Composites
GUO Jing, MENG Yongqiang, SUN Jinfeng*, ZHANG Shaofei
Key Lab of Flexible Functional Materials of Hebei Province, College of Material Science and Engineering, Hebei University of Science and Technology, Shijiazhuang 050018, China
Abstract: Diamond/copper composites show great prospect in thermal management applications due to their high thermal conductivity(TC) and low coefficient of thermal expansion (CTE) in theory. However, the actual TC is far below the theoretical TC, because of the poor interface affinity between diamond and copper. At usual atmospheric pressure, even the molten cooper can not wet the diamond. So the gaps with the high thermal resistance usually can be found between diamond and cooper. Optimized sintering and interface control techniques are usually used to improve the actual TC of diamond/copper composites (Dia/Cu). In this paper, the sintering techniques such as high temperature and high pressure, vacuum hot-pressing sintering, spark plasma sintering and infiltration are summarized. The bonding of diamond/copper interface can be strengthened by adding metal elements into copper matrix and surface metallization of diamond. Moreover, the problems of diamond/copper composites preparation and interface modification are pointed out, as well as the development trend.
作者简介: 郭靖,2017年6月毕业于河北科技大学,获得工学学士学位。现为河北科技大学材料科学与工程学院硕士研究生,在孙金峰教授的指导下进行研究。目前主要研究领域为高导热金刚石铜复合材料。 孙金峰,河北科技大学材料科学与工程学院副教授。2004年7月本科毕业于燕山大学材料科学与工程学院,2010年1月获得燕山大学材料学博士学位。2010年3月就职于河北科技大学,先后主持河北省自然科学基金项目、河北省科技厅科技支撑计划项目、河北省教育厅高等学校科学技术研究项目。长期从事粉末冶金、结构陶瓷、金属基复合材料等方面的研究,在Chinese Physics Letters、Journal of Alloys and Compounds、Journal of Inorganic Materials等SCI学术期刊发表相关领域研究论文10余篇,获授权发明专利5项。
引用本文:
郭靖, 孟永强, 孙金峰, 张少飞. 高导热金刚石/铜复合材料的制备与界面调控研究进展[J]. 材料导报, 2022, 36(15): 20090233-7.
GUO Jing, MENG Yongqiang, SUN Jinfeng, ZHANG Shaofei. Research Progress in the Preparation and Interface Modification of High Thermal Conductivity Diamond/Copper Composites. Materials Reports, 2022, 36(15): 20090233-7.
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