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材料导报  2022, Vol. 36 Issue (6): 20120254-6    https://doi.org/10.11896/cldb.20120254
  金属与金属基复合材料 |
磁控溅射和电镀方法制备纯银镀层耐蚀性能分析
王付胜1, 王汉森2, 何鹏1, 胡隆伟3, 陈亚军1
1 中国民航大学中欧航空工程师学院,天津 300300
2 中国民航大学航空工程学院,天津 300300
3 航天精工股份有限公司,贵州 遵义 563000
Corrosion Resistance Analysis of Pure Silver Coating Prepared by Magnetron Sputtering and Electroplating
WANG Fusheng1, WANG Hansen2, HE Peng1, HU Longwei3, CHEN Yajun1
1 Sino-European Institute of Aviation Engineering, Civil Aviation University of China, Tianjin 300300, China
2 Institute of Aviation Engineering, Civil Aviation University of China, Tianjin 300300, China
3 Guizhou Aerospace Precision Co.,Ltd.,Zunyi 563000, Guizhou, China
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摘要 分别采用磁控溅射与电镀方法制备了纯银镀层,对比两种工艺下制备的纯银镀层的耐蚀性及耐蚀机理。首先通过SEM、XRD、激光共聚焦显微镜和蔡司显微镜对镀层微观形貌、物相组成、表面粗糙度及镀层孔隙率进行表征,其次采用中性盐雾腐蚀试验和电化学测试比较了两种方法制备出的纯银镀层的耐蚀性。研究结果表明:磁控溅射纯银镀层呈细小、紧密的颗粒状结构,具有更好的厚度均匀性且为柱状晶生长模式;电镀纯银镀层呈沟壑起伏分布的粗大结构且平整性较差,前者具有更好的结晶度。磁控溅射获得的纯银镀层粗糙度较电镀纯银镀层下降22.5%,孔隙率较电镀银镀层也显著降低,为0.26%。磁控溅射纯银镀层经过192 h的盐雾腐蚀,未见明显腐蚀痕迹,依旧呈现亮白色光泽;电镀纯银镀层在腐蚀24 h后可见明显腐蚀斑点。通过电化学测试发现磁控溅射纯银镀层的腐蚀电流密度较电镀纯银镀层下降了48.3%。两者耐蚀性的差异主要源于磁控溅射过程中高能粒子之间的相互碰撞,使得银粒子在基体表面更加紧密地堆积,一定程度上阻断了腐蚀通道。同时溅射粒子在沉积表面具有较强的迁移能力,更易形成低缺陷的晶体结构,且较低的粗糙度与孔隙率使得磁控溅射纯银镀层在腐蚀环境中与腐蚀介质的实际接触面积更小,因此磁控溅射纯银镀层比电镀纯银镀层的耐蚀性能更优。
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王付胜
王汉森
何鹏
胡隆伟
陈亚军
关键词:  磁控溅射  电镀  纯银镀层  电化学测试  中性盐雾试验  耐腐蚀性能    
Abstract: In order to study the influence of magnetron sputtering and electroplating on the corrosion resistance and corrosion resistance mechanism of pure silver coatings. SEM, XRD, laser confocal microscopy and Zeiss microscopy were used to characterize the coating micro-morphology, phase composition, surface roughness and porosity of the coating, and the corrosion resistance of the pure silver coating was compared by salt spray corrosion test and electrochemical test. The results showed that the magnetron sputtering pure silver coating has a fine and compact granular structure, with better thickness uniformity and a columnar crystal growth pattern, while the electroplating pure silver coating has a rough structure with a ravine undulating distribution and poor flatness, the former having better crystallinity. The roughness of pure silver coating obtained by magnetron sputtering decreased by 22.5% compared with that of electroplated pure silver coating, and the porosity of pure silver coating obtained by magnetron sputtering decreased to 0.26%. After 192 h salt spray corrosion, the magnetron sputtering silver coating showed no obvious corrosion marks, and it still showed a bright white luster. Obvious corrosion spots can be seen on the electroplated pure coating after 24 h corrosion, and the electrochemical test showed that the corrosion current density of magnetron sputtering pure silver coating decreased by 48.3% compared with that of the eletroplating pure silver coating. The difference in corrosion resistance is mainly due to the collision of high-energy particles during magnetron sputtering, which makes the silver particles accumulate more closely on the substrate surface and blocks the corrosion channel to some extent. At the same time, the sputtering particles have strong migration ability on the deposition surface and are more likely to form the crystal structure with low defects. The lower roughness and porosity makes the actual contact area between magnetron sputtering pure silver coating and the corrosive medium smaller in the corrosion environment, so it has better corrosion resistance than the plating silver coating.
Key words:  magnetron sputtering    electroplating    pure silver coating    electrochemical experiment    neutral salt spray test    corrosion resistance
出版日期:  2022-03-25      发布日期:  2022-03-21
ZTFLH:  TG174  
基金资助: 中央高校基本科研业务费项目中国民航大学专项项目(3122019177)
通讯作者:  yjchen@cauc.edu.cn   
作者简介:  王付胜,硕士,实验师,主要从事于航空功能涂层性能研究。
陈亚军,博士,教授,目前主要从事航空功能涂层性能研究。2016年获得中国航空运输协会民航科学技术奖一等奖。
引用本文:    
王付胜, 王汉森, 何鹏, 胡隆伟, 陈亚军. 磁控溅射和电镀方法制备纯银镀层耐蚀性能分析[J]. 材料导报, 2022, 36(6): 20120254-6.
WANG Fusheng, WANG Hansen, HE Peng, HU Longwei, CHEN Yajun. Corrosion Resistance Analysis of Pure Silver Coating Prepared by Magnetron Sputtering and Electroplating. Materials Reports, 2022, 36(6): 20120254-6.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.20120254  或          http://www.mater-rep.com/CN/Y2022/V36/I6/20120254
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