Abstract: In the manufacturing cost of semiconductor components, the spending of packaging materials are second only to silicon wafers, and more than the cost of lead frame and photoresist. The effects of adhesive materials are the major facts on the packaging functionality. Epoxy adhesives are widely used in electronics assembly and packaging. They combine numerous desirable properties including low shrinkage, thermal stability, anti-UV properties and more environmentally friendly than lead-containing solder. Advanced packaging is developing towards high-density integration, high-power load and miniaturization, and more complicated packaging structures, which meet the needs for adhesives with more excellent performances. Epoxies may undermine the stability and reliability of packaged devices, because of high thermal expansion coefficient, inherent brittleness and easy cracking. How to improve the brittleness and thermal expansion of epoxy adhesives, to achieve comprehensive properties become a research hotspot in recent years. Through the additives of novel carbon nanoparticles and rubber, the brittleness and thermal expansion of epoxy adhesives can be altered and tailored for specific applications. Due to the rigidity-enhancing effect of nanoparticles, the strength and glass transition temperature of epoxy adhesive can be greatly improved;the toughness of epoxy adhesive can be significantly modified by rubber, but it may lose some strength and thermo-mechanical properties. Only rigid nanoparticles or rubber modification could not meet the stringent requirements of advanced packaging on mechanical properties of epoxy adhesives. In recent years, the effects of common impact modifiers rigid nanoparticles and liquid rubber on the mechanical properties of filled epoxy adhesives have attracted considerable attention, the composites of which were endowed with better properties of toughness and strength without weakening other performances. In addition, the ratio of free volume in the adhesive reduced by the interaction of rigid nanoparticles and epoxy resins, and the thermal expansion of polymer chain restrained by the tight binding of nanoparticles, both of which could markedly decrease the thermal expansion coefficient of epoxy adhesive. For epoxy/rubber nanocomposite adhesive system, because of the toughening of epoxy resin with rubber, is able to dissipate stresses and dampen the driving force of expansion. The interfacial bonding strength between the modified material and epoxy matrix can be improved through the surface functional modification of rigid nanoparticles and the design of the terminal structure of rubber, and promoting the uniform dispersion of the modified substance in the matrix is the key to promote the improvement of mechanical properties. The formulation of epoxy adhesive is intricate, combined with multi-scale modeling and high-throughput calculation of machine learning, the relationship between its structure and mechanical properties can be simulated and predicted, which will greatly shorten the research and development cycle of advanced epoxy adhesives. The recent developments for the improvement of the brittleness and thermal expansion of epoxy adhesives with the novel carbon nanoparticles and rubber were reviewed in this paper. The structural changes and corresponding modification mechanism caused by the addition of rigid nanoparticles and rubber in epoxy adhesive were investigated. Among them, the uniform dispersion of modified materials and the interfacial bonding strength with epoxy matrix were the key factors affecting the mechanical properties. To simulate the microstructure and predict mechanical properties of epoxy adhesives by the machine learning is of great significance for the development of advanced epoxy adhesives.
余春秀, 王云凯, 贺子娟, 李玮, 陈家林, 李世鸿, 李俊鹏. 电子封装用环氧胶粘剂改性研究进展[J]. 材料导报, 2023, 37(15): 21120084-10.
YU Chunxiu, WANG Yunkai, HE Zijuan, LI Wei, CHEN Jialin, LI Shihong, LI Junpeng. Research Progress on Modification of Epoxy Adhesives for Electronic Packaging. Materials Reports, 2023, 37(15): 21120084-10.
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2023, Vol. 37 
