Microstructure and Mechanical Properties of Al Alloy Joint Soldered with Ni Foam/In-48Sn Composite Solder
CHEN Gaiqing1, LIU Kai2, XU Xing1, WU Ying1, XIAO Yong2,*
1 The 38th Research Institute of China Electronics Technology Group Corporation, Hefei 230088, China 2 School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
Abstract: In-48Sn eutectic solder has the advantages of low melting point, high ductility, and good wettability, and is widely used in the soldering of microwave, communication, and other functional components. However, the mechanical properties of In-48Sn eutectic solder are poor, which made it difficult to meet the load requirements of the latest functional components. By adding trace alloys, nano-sized particles or fibers into In-Sn solders could improve the strength of them to a certain extent, but the strength improvements of joints using these solders were limited. Based on these, we prepared Ni foam strengthened In-48Sn composite solders by vacuum infiltration process, then using the as-fabricated composite sol-ders to join Ag coated Al alloy at low temperature. Effects of Ni foam porosity and soldering time on the microstructure and mechanical properties of the joints were studied. Results showed that the Ag2In intermetallic compound (IMC) layer formed on the Al alloy surface, the thickness of which increased with prolonging soldering time; moreover, the Ag2In phase tended to form a block structure in the solder seam when there were no Ni skeleton barriers. A (Ni, Cu)3(In, Sn)7 phase formed during the reaction between In-48Sn solder and Ni skeletons. Prolonging the soldering time and reducing the porosity of Ni foams could both promote the formation of reaction phases and accelerate the consumption of In-48Sn solder, accompanied by the shear strength improvements of the joints. Finally, the soldering seam was completely composed of Ni skeleton and IMCs. The joint soldered with 50%Ni-In48Sn composite solder for 120 min obtained a shear strength of 34.34 MPa, which was 335.2% higher than that soldered with In-48Sn eutectic solder.
通讯作者:
*肖勇,博士、副教授、博士研究生导师,2014年于哈尔滨工业大学(深圳)取得博士学位,谢菲尔德大学资助研究员(Sir SY Chung Fellowship)。主要研究方向为新型钎焊材料、新材料特种连接技术、电子装联技术等。近年来承担国家自然科学基金、装备预研领域基金、JPPT、企事业单位委托课题等项目20余项,相关成果获广东省科技进步二等奖。近年来在Carbon、Ultrasonics Sonochemistry、Materials Science and Engineering A、《材料导报》等期刊发表学术论文40余篇;授权发明专利10余项(已转化2项)。yongxiao@whut.edu.cn
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2023, Vol. 37 
