Research Status and Prospect of Low Thermal Resistance Liquid-cooled Heatsink Applied in Laser Diode
CHEN Lang1, LIU Jiachen1,2, ZHANG Jiachen1, WANG Zhenfu1, WANG Dan1, LI Te1,*
1 State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an 710119, China 2 University of Chinese Academy of Sciences, Beijing 100049, China
Abstract: In recent decades, the output power of laser diode has been continuously increasing, leading to the restricted problem of thermal loads. The thermal load causes a temperature increment in the active region of the LD chip, which further impacts the chip temperature distribution and leads to a gradual deterioration of the LD bar performance. For a defined package configuration, the thermal resistance of the heatsink becomes a decisive factor in controlling the temperature rise. Therefore, it is important to reduce the thermal resistance of the heatsink in order to improve the output power capability and beam properties of semiconductor lasers. From three aspects:liquid-cooled heatsink materials, liquid-cooled heatsink structures and liquid-cooled refrigerant properties, this paper reviews the evolution of thermal resistance of liquid-cooled heatsinks in the last three decades. We also summarize the factors influencing thermal resistance during the development of liquid-cooled heatsinks, and further discuss the development direction and application prospects of heatsink thermal resistance reduced.
陈琅, 刘嘉辰, 张佳晨, 王贞福, 王丹, 李特. 半导体激光器低热阻液冷热沉研究现状与展望[J]. 材料导报, 2023, 37(10): 21120232-8.
CHEN Lang, LIU Jiachen, ZHANG Jiachen, WANG Zhenfu, WANG Dan, LI Te. Research Status and Prospect of Low Thermal Resistance Liquid-cooled Heatsink Applied in Laser Diode. Materials Reports, 2023, 37(10): 21120232-8.
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