Optimizing Technology of the Preparation of AlN Thin Film by Magnetron Sputtering for Acoustic Resonators
MA Xinguo1,2, CHENG Zhengwang1, WANG Mei1, HE Jing1, ZOU Wei1, DENG Shuiquan3
1 School of Chip Industry, Hubei University of Technology, Wuhan 430068, China 2 Hubei Energy Optoelectronic Device and System Engineering Technology Research Center, Wuhan 430068, China 3 Fujian Institute of Research on Structure of Matter, Chinese Academy of Sciences, Fuzhou 350002, China
Abstract: Aluminum nitride (AlN) is one of the most attractive piezoelectric materials due to its excellent physiochemical properties and great compatibility with standard CMOS crystalline silicon technology. Therefore, AlN is advantageous as compared to other alternatives such as ZnO or lead zirconate titanate (PZT), where AlN thin films have great potential to become a key component in acoustic resonators in the 5G age. AlN thin films exhibit an excellent electromechanical coupling coefficient, high acoustic velocity, large elastic modulus, andhigh thermal conductivity. With the recent developments of thin film technology, good control of the film microstructure can be achieved, where the thin film quality directly determines the overall properties of the device, including the operating frequency, Q value and the overall reliability. In recent years, important progress has been made concerning the preparation technology of AlN thin films by reactive magnetron sputtering, leading to good control of the microstructure of well-formed films, using a high deposition rate, low price. Adjusting the many factors that influence the thin film quality may be rather challenging though to meet the requirements of the main physical parameters. Previous studies suggest that the directional growth of AlN thin films is affected by several factors such as the sputtering power, base pressure and N2/Ar flow ratio. Furthermore, it was reported that the thin film stress was extremely sensitive to changes in the Ar gas flow, whereas the surface roughness and film thickness were mainly affected by the sputtering power and base pressure. In addition to the basic parameters of reactive magnetron sputtering, it is generally found that the orientation of substrate during growth, the substrate material, the substrate cleanliness, the annealing temperature and atmosphere have significant effects on the crystallization and preferred orientation of thin films. Here in this work, we focus on several physical parameters of AlN thin films such as the preferential orientation of the crystal planes, film stress, surface roughness, and deposition rate, and their variations with sputtering power, gas partial pressure, and substrate temperature. Furthermore, we discuss several problems of AlN thin film work that remain to be solved in future and the possible directions that future research in this exciting field may proceed to.
马新国, 程正旺, 王妹, 贺晶, 邹维, 邓水全. 适用声波谐振器的磁控溅射制备AlN薄膜优化技术[J]. 材料导报, 2023, 37(11): 21080275-7.
MA Xinguo, CHENG Zhengwang, WANG Mei, HE Jing, ZOU Wei, DENG Shuiquan. Optimizing Technology of the Preparation of AlN Thin Film by Magnetron Sputtering for Acoustic Resonators. Materials Reports, 2023, 37(11): 21080275-7.
1 Aigner R, Fattinger G, Schaefer M, et al. Conference Record of IEEE International Electron Devices Meeting (IEDM). San Francisco, 2018, pp. 332. 2 Mahon S. IEEE Transactions on Semiconductor Manufacturing, 2017, 30(4), 494. 3 Hagelauer A, Fattinger G, Ruppel C C W, et al. IEEE Transactions on Microwave Theory and Techniques, 2018, 66(10), 4548. 4 Ali W R, Prasad M. Sensors and Actuators A, 2020,301, 111756. 5 Liu Y, Cai Y, Zhang Y, et al. Micromachines, 2020,11, 630. 6 Chang Y C, Chen Y C, Li B R, et al. Coatings, 2021,11, 397. 7 Wu T, Jin H, Dong S, et al. Sensors, 2020, 20(5), 1346. 8 Zhao J H, Xing Y H, Han J, et al. Semiconductor Science and Technology, 2021,36, 1. 9 Wang L, Lin A, Kim E S. IEEE Sensors Journal, 2018,18, 7633. 10 Cassellam C, Segovia-Fernandezmm J. IEEE Transactions on Ultrasonics Ferroelectrics & Frequency Control, 2019, 66(5), 958. 11 Iqbal A, Mohd-Yasin F. Sensors, 2018,18, 1797. 12 Kamohara T, Akiyama M, Ueno N, et al. Applied Physics Letters, 2006,89, 71919. 13 Wu H L, Zhao W, He C G, et al. Superlattices and Microstructures, 2019,125, 343. 14 Kumar A, Prasad M, Janyani V,et al. Journal of Nanoelectronics and Optoelectronics, 2019,14(9), 1267. 15 Wang J L, Park M, Mertin S, et al. Journal of Microelectromechanical Systems, 2020,4, 1. 16 Zhao J H, Han J, Xing Y H, et al. Semiconductor Science and Technology, 2020,35, 35009. 17 Mwema F M, Akinlabi E T, Oladijo O P. Materials Today: Proceedings, 2020, 4, 26. 18 Jin C F, Si M J, Xu Y, et al. Piezoelectrics & Acoustooptics, 2016, 38(4), 539 (in Chinese). 金成飞, 司美菊, 徐 阳, 等. 压电与声光, 2016, 38(4), 539. 19 Trant M, Fischer M, Thorwarth K,et al. Surface and Coatings Technology, 2018,348, 159. 20 Gauter S, Haase F, Kersten H. Thin Solid Films, 2019,669, 8. 21 Marenkov E, Nordlund K, Sorokin I, et al. Journal of Nuclear Materials, 2017,496, 18. 22 Lin J L, Chistyakov R. Applied Surface Science, 2016,396, 129. 23 Iqbal A, Walker G, Hold L, et al. Journal of Materials Science: Materials in Electronics, 2020,31, 239. 24 Takano Y, Hayakawa R, Suzuki M, et al. Japanese Journal of Applied Physics, 2021,60, 8. 25 Lan W H, Xu Y, Zhang Y C, et al. Journal of Synthetic Crystals, 2020, 49(6), 1040 (in Chinese). 兰伟豪, 徐阳, 张永川, 等. 人工晶体学报, 2020, 49(6), 1040. 26 Chauhan S S, Joglekar M M, Manhas S K. Journal of Electronic Mate-rials, 2018,47, 7520. 27 Chiu K H, Chen J H, Chen H R, et al. Thin Solid Films, 2007, 515(11), 4819. 28 Tan W, Xu J, Wang H H, et al. Chinese Journal of Vacuum Science and Technology, 2016, 36(10), 1092 (in Chinese). 谭伟, 徐军, 王行行, 等. 真空科学与技术学报, 2016, 36(10), 1092. 29 Ohtsuka M, Takeuchi H, Fukuyama H. Japanese Journal of Applied Phy-sics, 2016,55, 05FD08. 30 Xie B W, Ding F Z, Shang H J, et al. Rare Metals, 2021,40, 3668. 31 Imran S, Yuan J, Yin G, et al. Surface and Interface Analysis, 2017, 49(9), 885. 32 Lan W H. Research on techniques of coating FBAR filter for 5G communication sub-6GHz band. Master's Thesis, Chongqing University of Posts and Telecommunications, China, 2019 (in Chinese). 兰伟豪. 5G通信6GHz以下频段FBAR滤波器镀膜关键技术研究. 硕士学位论文, 重庆邮电大学, 2019. 33 Chen P, Peng Q C, Zhao B G, et al. Conference Record of Piezoelectricity, Acoustic Waves, and Device Applications. Singapore, 2007, pp. 119. 34 Uesugi K, Hayashi Y, Shojiki K, et al. Applied Physics Express, 2019, 12(6), 65501. 35 Lu T Y, Yang Y P, Lo H H, et al. The International Journal of Advanced Manufacturing Technology, 2021,114, 1975. 36 Peng H D, Xu Y, Zhang Y C, et al. Piezoelectrics & Acoustooptics, 2019, 41(2), 170 (in Chinese). 彭华东, 徐阳, 张永川, 等. 压电与声光, 2019, 41(2), 170. 37 Liu X Y. Research on air-gap type film bulk acoustic resonator (FBAR) filter. Master's Thesis, South China University of Technology, China, 2020 (in Chinese). 刘鑫尧. 空腔型薄膜体声波谐振器FBAR滤波器研究. 硕士学位论文, 华南理工大学, 2020. 38 Strunin V I, Chirikov N A. Journal of Physics: Conference Series, 2020,1546, 12119. 39 Du B. Reseach on the cavity structure of bulk acoustic wave filter and its wideband technology. Ph.D. Thesis, University of Electronic Science and Technology of China, China, 2019 (in Chinese). 杜波. 空腔型体声波滤波器及其宽带化技术研究. 博士学位论文, 电子科技大学, 2019. 40 Artieda A, Barbieri M, Sandu C S, et al. Journal of Applied Physics, 2009,105, 24504. 41 Yin J H, Zhou B D, Li L, et al. Semiconductor Science and Technology, 2021,36, 45012. 42 Panda P, Ramaseshan R, Ravi N, et al. Materials Chemistry and Phy-sics, 2017,200, 78. 43 Pandey A, Kaushik J, Dutta S, et al. Thin Solid Films, 2018,666, 143. 44 钟慧, 王诗元, 彭春瑞, 等. 中国专利, CN201910230149.1, 2019. 45 Iriarte G F, Reyes D F, González D, et al. Applied Surface Science, 2011,257, 9306. 46 Chu F T, Li C, Wang Z Z, et al. Rare Metal Materials and Engineering, 2013, 42(10), 2023. 47 Jin H. Study on the problems of thin film body acoustic resonator (FBAR) technology. Ph.D. Thesis, Zhejiang University, China, 2006 (in Chinese). 金浩. 薄膜体声波谐振器(FBAR)技术的若干问题研究. 博士学位论文, 浙江大学, 2006. 48 Yang J C, Meng X Q, Yang C T, et al. Applied Surface Science, 2013,287, 355. 49 Ge S W, Zhang B Z, Yang C T. Surface and Coatings Technology, 2019,358, 404. 50 Yang J C, Meng X Q, Fu W J. Piezoelectrics & Acoustooptics, 2013, 35(6), 866 (in Chinese). 杨健苍, 孟祥钦, 付伍君. 压电与声光, 2013, 35(6), 866. 51 Kim J. Coatings, 2021,11, 443. 52 Jiao X, Shi Y, Zhong H, et al. Journal of Materials Science: Materials in Electronics, 2015, 26(2), 801. 53 Zang Y, Li L B, Ren Z Q, et al. Surface and Interface Analysis, 2016, 48(10), 1029. 54 Stan G, Botea M, Boni G, et al. Applied Surface Science, 2015,353, 1195. 55 Wang J, Zhang Q, Yang G, et al. Journal of Materials Science: Materials in Electronics, 2016, 27(3), 3026. 56 Taurino A, Signore M, Catalano M, et al. Materials Letters, 2017,200, 18. 57 Jackson N, Olszewski O Z, Keeney L, et al. Conference Record of the 2015 International Conference on Microelectronic Test Structures (ICMTS). Tempe, 2015, pp. 193. 58 Zhang M, Yang J, Si C W, et al. Micromachines, 2015, 6(9), 1236.