Abstract: In this work, the Cu/6061Al diffusion pair was successfully prepared by high-energy ball milling and sintering forming process, and the effect of mechanical milling on the growth of the Cu/6061Al intermetallic compound layer at the Cu/6061Al interface during vacuum hot-pressing sintering was studied. The interface structure and products were characterized by XRD, FESEM, and EPMA analysis. The results show that three layers of copper-aluminum intermetallic compounds are observed at the interface, from Cu to the 6061Al side, there are Cu9Al4, CuAl, and CuAl2 phases in sequence. In addition, compared with the non-ball milled samples, many pores were observed in the Cu and Cu9Al4 regions of the samples after ball milling, which increased with the increase of the milling time. At the same time, the Cu/Cu9Al4 interface also becomes blurred with the increase of ball milling time. For each layered intermetallic compound, the effect of mechanical milling on the growth of the intermetallic compound layer was in descending order:Cu9Al4, CuAl, CuAl2, which was decreasing from the Cu side to the 6061Al side.
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2023, Vol. 37 
