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材料导报  2022, Vol. 36 Issue (1): 20100132-5    https://doi.org/10.11896/cldb.20100132
  金属与金属基复合材料 |
瞬态电流键合对Sn-Ag-Cu钎料焊点界面反应的影响
杨佳行1,2, 韩永典1,2, 徐连勇1,2
1 天津大学材料科学与工程学院,天津 300072
2 天津市现代连接技术重点实验室,天津 300072
Effect of Transient Current Bonding on Interfacial Reaction in the Sn-Ag-Cu Solder Joints
YANG Jiahang1,2, HAN Yongdian1,2, XU Lianyong1,2
1 School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China
2 Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China
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摘要 本工作利用电流作为热源对三明治型钎焊焊点实现瞬态键合,研究采用瞬态电流键合工艺对Sn-Ag-Cu钎料(SAC)进行处理时,所制得Cu/SAC/Cu三明治型焊点界面金属间化合物(IMC)的微观组织与力学性能。结果表明采用瞬态电流键合工艺,会在Cu/SAC界面形成致密的IMC层,实现有效的冶金结合。随着电流时间的延长,界面Cu6Sn5晶粒形貌发生短棒状-棱柱状-枝晶板片状转变。初期的短棒状金属间化合物形貌可用杰克逊因子α解释,在初始工艺中焊点温度快速上升至焊点峰值温度(245 ℃)。随着加载时间的延长,焊点的峰值温度不断升高,使得α′(T)不断增大;α快速增大,至α>2时,棱柱状Cu6Sn5晶粒在界面处形成。随着加载时间的延长,由于键合时间和电子风力的影响,Cu6Sn5晶体生长前沿的溶质富集区形成成分过冷区,液相线梯度增加,使得Cu6Sn5形貌转变为枝晶板片状。剪切试验表明,随着加载时间的延长,焊点剪切强度逐渐增大,其主要原因是界面IMC层厚度的增加为界面提供更好的冶金结合以及Cu6Sn5晶粒形貌的变化造成焊点由韧性断裂向韧-脆性混合断裂转变。
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杨佳行
韩永典
徐连勇
关键词:  瞬态电流键合  Sn-Ag-Cu钎料  金属间化合物  力学性能    
Abstract: In this paper,electric current was considered as the source of heating to achieve transient bonding of sandwich solder joints within hundred milliseconds. The microstructure and mechanical properties of the interface intermetallic compound (IMC) of Cu/SAC/Cu sandwich solder joints under the transient current bonding process were studied. The results showed that under the transient current bonding process, a dense IMC la-yer was formed at the Cu/SAC interface to form an effective metallurgical bond. With the increase of the current time, the morphology of the Cu6Sn5 at the Cu/SAC interface changed from short rod-prismatic-dendritic plate. The appearance of short rod-like intermetallic compound morphology at the initial interface can be explained by the Jackson factor α, and the solder joint temperature rises rapidly to reach the peak solder joint temperature of 245 ℃. As the loading time increased, the increasing peak temperature made α′(T) increase continuously. When α kept increasing until α>2, prismatic Cu6Sn5 grains were formed at the interface. With the increase of the current loading time, the interfacial dendritic plate-like Cu6Sn5 grain transition is mainly because the solute-rich region in the growth front of Cu6Sn5 crystal formed the component supercooling region caused by the increasing of bonding time and electron wind, which made the gradient of liquid phase line increase to cause the morphology transformation of Cu6Sn.The shear test showed that the increasing of shear strength with the increase of loading time was mainly due to the change of the interface Cu6Sn5 grain morphology which made the ductile fracture change to ductile-brittle mixed fracture.
Key words:  transient current bonding    Sn-Ag-Cu solder    intermetallic compound    mechanical properties
出版日期:  2022-01-13      发布日期:  2022-01-13
ZTFLH:  TG454  
基金资助: 国家自然科学基金资助项目(51974198)
通讯作者:  hanyongdian@tju.edu.cn   
作者简介:  杨佳行,天津大学在读研究生,主要从事微电子器件连接结构研究。
韩永典,天津大学材料科学与工程学院,副教授。2010年3月毕业于天津大学天津大学材料科学与工程学院,材料加工工程博士学位。2010年9月进入天津大学材料科学与工程学院工作至今,主要从事面向微电子器件、深海油气管线中在高温、低温、疲劳、腐蚀等极端复杂环境下工作的焊接/连接结构,长期从事结构高性能焊接/连接制造、增材制造及结构完整性评估等方面的研究工作,在国内外重要期刊发表论文60多篇。
引用本文:    
杨佳行, 韩永典, 徐连勇. 瞬态电流键合对Sn-Ag-Cu钎料焊点界面反应的影响[J]. 材料导报, 2022, 36(1): 20100132-5.
YANG Jiahang, HAN Yongdian, XU Lianyong. Effect of Transient Current Bonding on Interfacial Reaction in the Sn-Ag-Cu Solder Joints. Materials Reports, 2022, 36(1): 20100132-5.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.20100132  或          http://www.mater-rep.com/CN/Y2022/V36/I1/20100132
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