Abstract: Silicate glass and aluminium alloy dissimilar material joints have good applications prospect in aerospace, electronic communications, and other fields because of their excellent functions and stable mechanical properties. This paper analyses the weldability of glass and aluminium alloy, summarises and reviews the current research results of glued bonding, semi-solid bonding and welding technology of silicate glass and aluminium alloy. Additionally, the bonding mechanism of silicate glass and aluminium alloy are analysed in detail. The future research and development of dissimilar material bonding like glass and aluminium alloy are also discussed. A new composite bonding process, which base on soldering and combined with external filed, may be one of the future research directions to construct high-quality bonding of silicate glass and aluminium alloy dissimilar materials.
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