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材料导报  2023, Vol. 37 Issue (7): 21090292-7    https://doi.org/10.11896/cldb.21090292
  金属与金属基复合材料 |
电子级超细树枝状铜粉的抗氧化性研究
方亚超1, 潘明熙2, 黄惠1,2,*, 何亚鹏1, 张盼盼1, 杨聪庆1, 郭忠诚1, 陈步明1
1 昆明理工大学冶金与能源工程学院,昆明 650093
2 昆明高聚科技有限公司,昆明 650106
Study on the Oxidation Resistance of Electronic Grade Ultrafine Dendritic Copper Powder
FANG Yachao1, PAN Mingxi2, HUANG Hui1,2,*, HE Yapeng1, ZHANG Panpan1, YANG Congqing1, GUO Zhongcheng1, CHEN Buming1
1 College of Metallurgy and Energy Engineering, Kunming University of Science and Technology, Kunming 650093, China
2 Kunming Gaoju Technology Co., Ltd., Kunming 650106, China
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摘要 超细铜粉被广泛应用于电子浆料,由于其比表面积大和表面活性高,易被氧化生成氧化铜或氧化亚铜,从而其导电性及活性降低。本工作采用苯并三氮唑与表面处理剂复配后对电子级超细树枝状铜粉进行表面处理,通过高温氧化、电导率、形貌以及物相等分析,研究了表面处理剂对铜粉的抗氧化性、导电性、形貌和物相结构的影响规律。结果表明,经过表面处理后的铜粉在100~200 ℃的导电性均比未处理的铜粉有不同程度提高,其导电性也较好,即电阻率仍保持0.224 Ω·cm,表面无明显氧化铜或氧化亚铜生成,且树枝状结构也未发生塌陷。因此,采用复配表面处理后,电子级超细树枝状铜粉的抗氧化性得到提升,满足中低温电子浆料的导电填料要求。
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方亚超
潘明熙
黄惠
何亚鹏
张盼盼
杨聪庆
郭忠诚
陈步明
关键词:  电子浆料  超细铜粉  树枝状  抗氧化性  导电性    
Abstract: Ultrafine copper powder is widely employed as materials in electronic pastes. Due to its large specific surface area and high surface activity, it is easy to be oxidized to produce copper oxide or cuprous oxide, thereby reducing its conductivity and activity. In this work, surface treatment of the electronic grade ultrafine dendritic copper powder was conducted by the combination of benzotriazole and surface treatment agent. Through high temperature oxidation, conductivity, morphology and substance equivalence analysis, the effect of surface treatment agent on the oxidation resistance, conductivity, morphology and phase structure of copper powder were studied. The results suggest that the conductivity of the copper powder after the surface treatment at 100—200 ℃ was improved to different degrees than that of the untreated copper powder. The sample also exhibited better conductivity and still maintained the resistivity of 0.224 Ω·cm. Besides, no obvious copper oxide or cuprous oxide produced, and collapse of the dendritic shape structure was observed. Therefore, benefitting from the introduction of the benzotriazole and surface treatment agent, the oxidation resistance of the electronic grade ultrafine dendritic copper powder is considerably improved, which could meet the requirement of conductive fillers for medium-low temperature electronic pastes.
Key words:  electronic paste    ultra-fine copper powder    dendritic    oxidation resistance    conductivity
出版日期:  2023-04-10      发布日期:  2023-04-07
ZTFLH:  TF80  
基金资助: 国家自然科学基金(52064028);云南省基础研究计划重点项目(202101AS070013);云南省中央引导地方专项(202107AC110009)
通讯作者:  * 黄惠,昆明理工大学冶金与能源工程学院教授、博士研究生导师。2000年毕业于四川大学化学学院高分子专业,获学士学位,2006年7月毕业于云南大学化学与材料工程学院材料专业,获硕士学位,2010年3月毕业于昆明理工大学冶金与能源工程学院冶金物理化学专业,获博士学位,同年留校任教至今。主要从事导电高分子新型节能电极材料、储能材料、特种功能粉体材料、冶金电化学及湿法冶金新材料等应用基础研究及科技成果转化应用工作。申请国家发明专利38项,出版专著4部,发表学术论文100余篇。huihuanghan@kust.edu.cn   
作者简介:  方亚超,2019年6月毕业于辽宁科技学院,获得工学学士学位。现为昆明理工大学冶金与能源工程学院硕士研究生,在黄惠教授的指导下进行研究。目前主要研究领域为粉末冶金。
引用本文:    
方亚超, 潘明熙, 黄惠, 何亚鹏, 张盼盼, 杨聪庆, 郭忠诚, 陈步明. 电子级超细树枝状铜粉的抗氧化性研究[J]. 材料导报, 2023, 37(7): 21090292-7.
FANG Yachao, PAN Mingxi, HUANG Hui, HE Yapeng, ZHANG Panpan, YANG Congqing, GUO Zhongcheng, CHEN Buming. Study on the Oxidation Resistance of Electronic Grade Ultrafine Dendritic Copper Powder. Materials Reports, 2023, 37(7): 21090292-7.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.21090292  或          http://www.mater-rep.com/CN/Y2023/V37/I7/21090292
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