Preparation and Properties of Cyanate Ester Conductive Adhesive Resistant to 400 ℃
SUN Yikun1, ZHU Zhaoxian2, WANG Tao2, NIU Bo1,*, LONG Donghui1,*
1 School of Chemical Engineering, East China University of Science and Technology, Shanghai 200237, China 2 The 58th Research Institute of China Electronics Technology Group Co., Ltd., Wuxi 214035, Jiangsu, China
Abstract: To restrain the chip debonding and gas production in package caused by high temperature welding during the chip sealing, cyanate ester conductive adhesive(CECA)with high temperature resistance of 400 ℃ was prepared using high purity flake silver powder as filler and cyanate ester resin as matrix. The microstructure analysis results show that Ag flakes were randomly distributed in the cyanate ester matrix, forming a good thermal and electric conductive network, and removing the organic matter on the surface of Ag powders can effectively inhibit the generation of bubbles and cracks, after the CECA was bonded and cured. Thermogravimetric analysis results show that the weight loss rate of the conductive adhesive is only 0.06% at 300 ℃ and less than 0.3% at 400 ℃, which are far lower than the current weight loss rate of conductive adhesive at the same temperature. The results of thermal performance test show that the Tg of conductive adhesive is 240 ℃, and the CTE is 51.2×10-6/℃ below Tg and 162.2×10-6/ ℃ above Tg. What's more, the environmental test and mechanical properties test show that the adhesive has strong adhesive strength and environmental adaptability. When the curing temperature is 330 ℃, the average chip shear strength is up to 18.4 MPa. In conclusion, the CECA prepared in this paper has excellent comprehensive properties, which provides an important reference for the development and application of high temperature conductive adhesive.
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2023, Vol. 37 
