Abstract: The effects of temperature and pH value on electroless copper plating on mesophase pitch-based graphite fibers (MPGFs) were investigated in this work. The surface morphology and components of copper-coated MPGFs were characterized by scanning electron microscopy-energy dispersive spectrometer (SEM-EDS) and X-ray diffraction (XRD). And the resistivity and adhesion properties of copper-coated MPGFs were also measured. The results showed that MPGFs were coated by a dense and uniform copper layers when the temperature and pH value were 60 ℃ and 13.0. Moreover, the resistivity of copper-coated MPGFs with excellent adhesion decreased to 7.52 μΩ·cm.
孙东健,杨建校,马国芝,周娩红,刘洪波. 中间相沥青基石墨纤维表面化学镀铜及性能表征[J]. 《材料导报》期刊社, 2017, 31(24): 129-132.
SUN Dongjian, YANG Jianxiao, MA Guozhi, ZHOU Mianhong, LIU Hongbo. Fabrication and Characterization of Copper-coated Mesophase Pitch-based Graphite Fibers by Electroless Copper Plating. Materials Reports, 2017, 31(24): 129-132.
1 Park S J, Jung W Y. Adsorption behaviors of chromium(Ⅲ) and (Ⅵ) on electroless Cu-plated activated carbon fibers[J]. J Colloid Interface Sci, 2001,243(2):316. 2 Morgan P. Carbon fibers and their composites[M]. New York:Taylor & Francis Group, 2005:534. 3 Chen D H, Yao G C, Cao Z K. A precious metal-free electroless technique for the deposition of copper on carbon fibers[J]. Metall Mater Trans A, 2012,43(11):4194. 4 Liu L, Tang Y P, Zhao H J, et al. Fabrication and properties of short carbon fibers reinforced copper matrix composites[J]. J Mater Sci, 2008,43(3):974. 5 Tang Y P, Liu H Z, Zhao H J, et al. Friction and wear properties of copper matrix composites reinforced with short carbon fibers[J]. Mater Des, 2008,29(1):257. 6 Neubauer E, Korb G, Eisenmenger-Sittner C, et al. The influence of mechanical adhesion of copper coatings on carbon surfaces on the interfacial thermal contact resistance[J]. Thin Solid Films, 2003,433(1-2):160.7 Schrank C, Eisenmenger-Sittner C, Neubauer E, et al. Solid state de-wetting observed for vapor deposited copper films on carbon substrates[J]. Thin Solid Films, 2004,459(1):276. 8 Wan Y Z, Wang Y L, Luo H L, et al. Effects of fiber volume fraction, hot pressing parameters and alloying elements on tensile strength of carbon fiber reinforced copper matrix composite prepared by continuous three-step electrodeposition[J]. Mater Sci Eng A, 2000,288(1):26. 9 Lu W, Donepudi V S, Prakash J, et al. Electrochemical and thermal behavior of copper coated type MAG-20 natural graphite[J]. Electrochim Acta, 2002,47(10):1601. 10Barmouz M, Givi M K B, Seyfi J. On the role of processing parameters in producing Cu/SiC metal matrix composites via friction stir processing: Investigating microstructure, microhardness, wear and tensile behavior[J]. Mater Charact, 2011,62(1):108. 11Hou W, Pan G P, Guan H, et al. Optimization of process conditions for electroless copper plating on carbon fiber[J]. Electroplating Finishing, 2007,26(9):23(in Chinese). 侯伟,潘功配,关华,等.碳纤维表面化学镀铜工艺的优化[J].电镀与涂饰,2007,26(9):23. 12Chen H Y, Liu G L, Xu C J, et al. Copper@carbon fiber composites prepared by a simple electroless plating technique[J]. Mater Lett, 2016,173:211. 13Kang S S, Ji H, Gul H Z, et al. Metal-coated carbon fiber for lighter electrical metal wires[J]. Synth Met, 2016,222:180. 14Zhang H, Chao M, Zhang H, et al. Microstructure and thermal properties of copper matrix composites reinforced by chromium-coated discontinuous graphite fibers[J]. Appl Therm Eng, 2014,73(1):739. 15Silvain J F, Petitcorps Y L, Sellier E, et al. Elastic moduli, thermal expansion and microstructure of copper-matrix composite reinforced by continuous graphite fibres[J]. Composites, 1994,25(7):570. 16Nakahara S, Okinaka Y. Microstructure and mechanical properties of electroless copper deposits[J]. Mater Res, 1991,21(21):93. 17Donahue F M, Wong K L M, Bhalla R. Kinetics of electroless copper plating-4. Empirical rate law for H2CO-EDTA baths[J]. Electrochem Soc, 1980,127(11):2340. 18伍学高. 塑料电镀技术[M]. 成都:四川科学技术出版社, 1983:359. 19Guo R H, Jiang S Q, Yuen C W M, et al. An alternative process for electroless copper plating on polyester fabric[J]. J Mater Sci: Mater Electron, 2009,20(1):33. 20Cui X Y, Hutt D A, Conway P P. Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate[J].Thin Solid Films, 2012,520:6095. 21Tai Y, Chen H, Xu C, et al. Conductive glass fabrics@nickel composites prepared by a facile electroless deposition method[J]. Mater Lett, 2016,171:158. 22Sabayev V, Croitoru N, Inberg A, et al. The evolution and analysis of electrical percolation threshold in nanometer scale thin films deposited by electroless plating[J]. Mater Chem Phys, 2011,127(1):214. 23Zuo J D, Chen S J, Luo C Y, et al. Preparation of electroless copper coated glass fiber and piezoresistive properties of copper coated glass fiber reinforced plastics[J]. Appl Surf Sci, 2015,349:319.
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2017, Vol. 31 
