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材料导报  2022, Vol. 36 Issue (23): 21100167-7    https://doi.org/10.11896/cldb.21100167
  高分子与聚合物基复合材料 |
树脂传递模塑成型工艺复合材料孔隙表征和孔隙形成预测研究进展
肖昌伟, 李文晓*
同济大学航空航天与力学学院,上海 200092
Research Progress of Void Characterization and Filling-induced Void Prediction of RTM-prepared Composites
XIAO Changwei, LI Wenxiao*
School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai 200092, China
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摘要 复合材料制造缺陷严重影响制品的力学性能,通过对缺陷形成规律的探究,可以有效降低缺陷形成,提高制品力学性能。孔隙在各类工艺中有着较高的形成概率,在树脂传递模塑成型(RTM)工艺中更是如此,孔隙也因此成为被研究最多的制造缺陷。本文从试验的角度介绍了RTM工艺中形成的孔隙的特征以及孔隙在线监测法、密度法、超声波法、显微镜法和显微CT法等孔隙表征手段,描述了RTM工艺孔隙的形成机理,并综述了充模过程中孔隙形成过程的数值模拟研究与应用现状,最后展望了RTM工艺复合材料孔隙预测的发展方向。
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肖昌伟
李文晓
关键词:  树脂传递模塑成型工艺  孔隙  试验研究  数值模拟  孔隙表征    
Abstract: The manufacturing defects of composites can seriously affect the mechanical properties of composites. By exploring the formation law of manufacturing defects, the formation of defects can be effectively reduced, then the mechanical properties of products can be improved. Due to the high formation probability in various processes, especially in the resin transfer molding (RTM) process, voids have been the most studied manufacturing defects. This paper briefly introduces the characteristics of void formed in the RTM process and research progress of techniques for void characterization such as online monitoring method, density method, ultrasonic method, microscope method and micro-CT method, then the void formation mechanism of RTM process is elaborated. The research progress of void formation process based on numerical simulation is summarized. Finally, the challenges and outlook of the numerical simulation on the void formation of the RTM process are outlined.
Key words:  resin transfer molding process    void    experimental research    numerical simulation    void characterization
发布日期:  2022-12-09
ZTFLH:  TB332  
基金资助: 航空基金项目(2015ZF38007);中央高校基本科研业务费专项资金项目(22120180133)
通讯作者:  *wenxiaoli@tongji.edu.cn   
作者简介:  肖昌伟,2019年6月毕业于同济大学,获得工学学位。2019年9月至今就读于同济大学,攻读工学硕士学位,在李文晓副教授的指导下进行研究。主要从事RTM工艺复合材料的制备研究。
李文晓,同济大学航空航天与力学学院副教授。1990年于国防科大获本科学位,1993年于上海交通大学获硕士学位,2000年于上海交通大学获博士学位;主要研究方向为树脂基复合材料;发表论文60余篇,获发明专利授权7项。
引用本文:    
肖昌伟, 李文晓. 树脂传递模塑成型工艺复合材料孔隙表征和孔隙形成预测研究进展[J]. 材料导报, 2022, 36(23): 21100167-7.
XIAO Changwei, LI Wenxiao. Research Progress of Void Characterization and Filling-induced Void Prediction of RTM-prepared Composites. Materials Reports, 2022, 36(23): 21100167-7.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.21100167  或          http://www.mater-rep.com/CN/Y2022/V36/I23/21100167
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