Research Progress and Prospect of Vibrothermography in Different Defect Types
GAO Zhifeng1,DONG Lihong2, WANG Haidou2, LYU Zhenlin1, GUO Wei2, WANG Bozheng3
1 School of Materials Sciences and Engineering, Xi’an University of Technology, Xi’an 710048, China 2 National Key Laboratory for Remanufaeturing,Academy of Armored Forces,Beijing 100072, China 3 School of Engineering and Technology, China University of Geosciences, Beijing 100083, China
Abstract: As a new type of non-destructive testing technology, infrared detection has been widely used in life, industry, aerospace and other fields. It has become an indispensable part of modern industry. It has the advantages of non-contact, fast detection and real-time monitoring compared with traditional detection technology. Vibrothermography detection technology belongs to infrared non-destructive testing. Because of its large single excitation area, it is not limited by the shape of the component during testing, and it has a good detection effect on microcracks which are difficult to detect by conventional detection techniques. However, the vibrothermography technology is susceptible to detection conditions (preload, coupling material) and detection parameters (excitation frequency, amplitude, time) during detection, which makes the detection results less reproducible and poorly effective. In addition to the investigation of the test conditions and parameters, the researchers focused on the adaptability of the technology in different defect detection. It has been successfully applied in the detection of corrosion delamination, impact damage, cracks, buried defects and the like. Among them, crack defect detection is the earliest application. It has good detection effect on microcracks of complex shapes, and can show the degree of crack propagation and the degree of damage of components. Corrosion delamination and impact damage of composite materials are the most widely used and can be detected. The location and size of the layer, the degree of impact damage; and the buried defects have only been applied in recent years. Although the underlying coating and the internal buried crack can be detected, there are limitations of the detection depth, and the detected effect is on image processing. There is a big dependency. Firstly, the principle, development history and some equipments and common image processing techniques of vibrothermography technology are introduced firstly. Then, the heat generation mechanism (friction, viscoelastic effect, plastic deformation) and its corrosion in the technology are reviewed. Research status of layers, impact damage, fatigue cracks and buried cracks. Finally, the advantages and disadvantages of vibration infrared thermal imaging technology are briefly summarized. It is pointed out that reducing power, improving the sharpness of image proces-sing and improving algorithms, and integrating multiple detection methods are the key development directions of this technology in the future.
1 Balageas D, et al. Journal of Nondestructive Evaluation,2016,35(1),18. 2 Jedrasiak P, Shercliff H R. Materials & Design,2018,158,184. 3 Ibarra-Castanedo C, Grinzato E, Marinetti S, et al. In: 17th World Conference on Nondestructive Testing, Shanghai, China,2008,pp.3922. 4 Mendioroz A, Castelo A, Celorrio R, et al. Measurement Science and Technology,2013,24(6),065601. 5 Xiang M, Dong L H, Wang H D, et al. Laser & Infrared,2018,48(6),667(in Chinese). 向明,董丽虹,王海斗,等.激光与红外,2018,48(6),667. 6 Reifsnider K L, Henneke E G, Stinchcomb W W. In:The mechanics of vibrothermography. Springer, Boston, MA,1980,pp.249. 7 Henneke E G, Reifsnider K L, Stinchcomb W W. JOM,1979,31(9),11. 8 Adams R D, Cawley P, Pye C J, et al. Journal of Mechanical Enginee-ring Science,1978,20(2),93. 9 Jia Y, Zhang R, Zhang W, et al. IOP Publishing,2018,389(1),012023. 10 Favro L D, Han X, Ouyang Z, et al. Proceedings of SPIE- The International Society for Optical Engineering,2000,4020(4020),182. 11 Rantala J, Wu D, Busse G.In:Research in Nondestructive Evaluation,1995,pp.215. 12 Han X, Loggins V, Zeng Z, et al. Applied Physics Letters,2004,85(8),1332. 13 Song Y, Han X. Infrared Physics & Technology,2014,66(9),43. 14 Burke M W, Miller W O. International Society for Optics and Photonics,2004,5405,313. 15 Holland S D. AIP Conference Proceedings,2007,894(1),478. 16 Holland S D, Uhl C, Renshaw J. AIP Conference Proceedings,2008,975(1),491. 17 Solodov I, Busse G. Applied Physics Letters,2013,102(6),061905. 18 Favro L D, Han X, Proceedings of SPIE-The International Society for Optical Engineering,2000,4020(4020),182. 19 Pye C J, Adams R D. NDT International,1981,14(3),111. 20 Rizi A S, Hedayatrasa S, Maldague X, et al. Infrared Physics & Techno-logy,2013,61,101. 21 Solodov I, Busse G. Applied Physics Letters,2013,102(6),061905. 22 Holland S D, Uhl C, Renshaw J. AIP Conference Proceedings,2008,975(1),491. 23 Gleiter A, Riegert G, Zweschper T, et al. Insight-Non-Destructive Testing and Condition Monitoring,2007,49(5),272. 24 Zweschper T, Dillenz A, Riegert G, et al. Insight-Non-Destructive Testing and Condition Monitoring,2003,45(3),178. 25 Umar M Z, Vavilov V, Abdullah H, et al. Russian Journal of Nondestructive Testing,2016,52(4),212. 26 Vavilov V P, Burleigh D D. NDT & E International,2015,73,28. 27 Bai G, Lamboul B, Roche J M, et al. Quantitative InfraRed Thermography Journal,2016,13(1),15. 28 Reifsnider K L, Henneke E G, Stinchcomb W W. The mechanics of vibrothermography, Plenum Press, New York,1980. 29 Guan H Q,Guo X W, Ma F N. Nondestructive Testing,2016,38(9),1(in Chinese). 管和清,郭兴旺,马丰年.无损检测,2016,38(9),1. 30 Renshaw J, Holland S D, Thompson R B, et al. International Journal of Fatigue,2011,33(7),849. 31 Lu J, Han X, Newaz G, et al. Nondestructive Testing and Evaluation,2007,22(2-3),127. 32 Chen JC, Kephart J, Lick K, et al. Nondestructive Testing and Evaluation,2007,22(2),83. 33 Chen D, Zhang C, Zeng Z, et al. International Society for Optics and Photonics,2009,7512,751206. 34 Park H, Choi M, Park J, et al. Infrared Physics & Technology,2014,62,124. 35 Choi M, Park J, Park H, et al. Journal of the Korean Society for Nondestructive Testing,2015,35(3),215. 36 Ibarra-Castanedo C, Genest M, Guibert S, et al. International Society for Optics and Photonics,2007,6541,654116. 37 Liu B, Zhang H, Fernandes H, et al. Sensors,2016,16(5),743. 38 Boccardi S, Boffa N D, Carlomagno G M, et al. Journal of Physics: Conference Series,2015,658(1),012007. 39 Lamboul B, Passilly F, Roche J M, et al. AIP,2015,1650(1),319. 40 Kersemans M, Verboven E, Segers J, et al. Multidisciplinary Digital Publishing Institute Proceedings,2018,2(8),554. 41 He Y, Chen S, Zhou D, et al. IEEE Transactions on Industrial Informa-tics,2018,14(12),5575. 42 Zheng J, Zheng K, Zhang S Y. Nondestructive Testing,2009,31(12),946(in Chinese). 郑江,郑凯,张淑仪.无损检测,2009,31(12),946. 43 Imanishi D, Nishina Y, Yoshinaga Y. International Society for Optics and Photonics,2012,8354,83540A. 44 Feng F Z, Zhang C S, Song A B, et al. Infrared and Laser Engineering,2016,45(3),60(in Chinese). 冯辅周,张超省,宋爱斌,等.红外与激光工程,2016,45(3),60. 45 Genest M, Mabrouki F, Fahr A, et al. International Society for Optics and Photonics,2009,7294,72940Y. 46 Jia Y, Zhang R, Zhang W, et al. IOP Publishing,2018,389(1),012023. 47 Lick K, Urcinas J, Austin P, et al. AIP,2008,975(1),504. 48 Mendioroz A, Castelo A, Celorrio R, et al. Measurement Science and Technology,2013,24(6),065601. 49 Mendioroz A, Celorrio R, Cifuentes á, et al. International Society for Optics and Photonics,2016,9861,98610E. 50 Chaki S, Marical P, Panier S, et al. Ndt & E International,2011,44(6),519. 51 Piau J M, Bendada A, Maldague X, et al. International Society for Optics and Photonics,2007,6541,654112. 52 Montanini R, Freni F, Rossi G L. Review of Scientific Instruments,2012,83(9),094902.
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2020, Vol. 34 
