Evolution of Phase, Microstructure and Physical Properties of Ti2SnC-reinforcing Ag-based Composite with Elevated Preparing Temperature
DING Jianxiang1,2, XIA Xinxin2, ZHANG Kaige2, DING Kuankuan2, MA Chengjian3, ZHANG Peigen1,*, SUN Zhengming1,2,*
1 Jiangsu Key Laboratory of Advanced Metallic Materials, School of Materials Science and Engineering, Southeast University, Nanjing 211189, China 2 School of Materials Science and Engineering, Anhui University of Technology, Ma'anshan 243002, Anhui, China 3 Analytical and Testing Center, Yancheng Institute of Technology, Yancheng 224051, Jiangsu, China
Abstract: Ti2SnC-reinforcing Ag-based composites show potential in the electrical contacts for low-voltage switches field. In this study, Ag/10wt%Ti2SnC (Ag/10TSC) composites were prepared by powder metallurgy at different preparing temperatures. Phase transition, microstructure evolution, interface behavior of Ti2SnC with Ag were investigated. The results show that the Ti2SnC remains intact structure and has weak interface diffusion with Ag under low preparing temperature (200—750 ℃), and the physical bonding gives Ag/10TSC composite high hardness and good electrical conductivity. Induced by elevated temperature (800—900 ℃), more Sn escape from Ti2SnC and diffuse with Ag, and the gradually dissociated Ti2SnC provide a channel for the oxygen infiltration, resulting in a small amount of oxides surrounding Ti2SnC. The Ag-Sn interdiffusion enhances the interface bonding between Ti2SnC and Ag matrix, and the tensile strength of composites increase significantly at the expense of electrical conductivity. At 950 ℃, TiSnC with gradual structural dissociation and oxidation produce agglomerated small particles, which causes the severe deformation and performance degradation of composites. The research results provide a theoretical basis for the future practical application of Ag/MAX electrical contact materials.
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