材料导报 2021, Vol. 35 Issue (z2): 589-592
高分子与聚合物基复合材料
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酚醛树脂在铝基板上的应用
范翠红, 秦会斌, 周继军
杭州电子科技大学,新型电子器件与应用研究所,杭州 310018
Application of Phenolic-formaldehyde Resin on CCL
FAN Cuihong, QIN Huibin, ZHOU Jijun
Institute of Electron Device & Application, Hangzhou Dianzi University, Hangzhou 310018, China
摘要 本研究利用耐高温固化剂制备出耐高温覆铜铝基板。根据环氧树脂、苯氧树脂、酚醛树脂、填料含量四个因素,设计不同水平的正交实验,通过极差分析和方差分析方法,确定了填料的填充量为绝缘层导热系数的重要因素,其次是酚醛树脂,酚醛树脂含量越低,覆铜铝基板的导热系数越高,最高为1.99 W/(m·K),且软化点T g可达到229.73 ℃。
关键词:
耐高温覆铜铝基板
酚醛树脂
导热系数
软化点
Abstract: High Temperature CCL was prepared by using high temperature's curing agent. According to the four factors of epoxy, phenoxy, phenolic- formaldehyde and the content of filler, different levels of orthogonal test were designed. Through range analysis and variance analysis, it was determined that the content of filler was an important factor of thermal conductivity of insulation layer, followed by phenolic-formaldehyde.The lower the content of phenolic-formaldehyde, the higher the thermal conductivity, and the highest was 1.99 W/(m·K), and the fusion point of T g could reach 299.53 ℃.
Key words:
high temperature CCL
phenolic-formaldehyde resin
thermal conductivity
fusion point
发布日期: 2021-12-09
基金资助: 浙江省科技计划项目(2017C01027)
通讯作者:
xanadu_forever@163.com
作者简介: 范翠红,杭州电子科技大学硕士研究生,主要研究方向为电路与系统。 秦会斌,杭州电子科技大学教授,博士研究生导师。主要研究领域为电子信息材料与电子信息器件的分析、设计与研制工作、智能化、集成化传感技术。
1 陆倩颖,缪程平,杨凌伟,等.浙江化工,2020,51(6),25. 2 魏文康,虞鑫海,李智杰,等.合成技术及应用,2020,35(1),33. 3 陶平均,孟昭光,谢至薇,等.广东化工,2021,48(2),8. 4 吴小青.高导热电路基板的设计与开发.硕士学位论文,杭州电子科技大学,2020. 5 汪蔚,曹万荣,陈婷婷.复合材料学报,2018,35(2),275.
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