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材料导报  2019, Vol. 33 Issue (Z2): 419-423    
  金属与金属基复合材料 |
梯度纳米多晶铜纳米切削过程的分子动力学仿真
王子云, 赵鹏越, 郭永博, 张凯, 王康
精密工程研究所(哈尔滨工业大学),哈尔滨150001
Simulation on Nano-cutting Process of Gradient Nano-crystalline Copper withMolecular Dynamics Method
WANG Ziyun, ZHAO Pengyue, GUO Yongbo, ZHANG Kai, WANG Kang
Center for Precision Engineering (Harbin Institute of Technology), Harbin 150001
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摘要 梯度纳米多晶金属材料具有优良的塑性和强度特性,适合作为微纳系统的制造材料,近年来逐渐成为研究热点。为研究梯度多晶材料的加工去除机理,采用Poisson-Voronoi方法建立大规模梯度多晶铜分子动力学模型,数值模拟梯度多晶铜的纳米切削过程,对比分析切割细晶层(过程1)和切割粗晶层(过程2)的切削力、缺陷和应力等参数。仿真结果表明,过程1的切削力明显小于过程2,而过程2的切削力波动较大。比较分析整个切削过程的缺陷数量和分布,发现过程2的缺陷数量高于过程1;分析刀具附近缺陷的形成过程发现,过程1的缺陷主要在刀具前形核并扩散,过程2的缺陷主要在刀具前和刀具底部形核并扩散;基于应力分析发现,过程2的范式等效应力大于过程1。本研究可为梯度纳米多晶铜的纳米切削机理提供参考。
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王子云
赵鹏越
郭永博
张凯
王康
关键词:  梯度纳米多晶铜  纳米切削  切削力  缺陷  内应力    
Abstract: Due to the excellent plasticity and strength properties, gradient nanocrystalline metal materials are suitable for the manufacture material of micro-nanometer systems and have gradually become a research hotspot in recent years. In order to study the processing and removal mechanism of gradient polycrystalline materials, the Poisson-Voronoi method is used to build a large-scale gradient polycrystalline copper molecular dynamics model and simulate the nano-cutting process of gradient polycrystalline copper. The cutting force, defect and stress of cutting fine crystal layer (process 1) between cutting coarse crystal layer (process 2) are compared and analyzed. The results show that the cutting force of process 1 is obviously less than that of process 2, and the cutting force of process 2 fluctuates greatly. Comparing the number and distribution of defects in the whole cutting process, it is found that the number of defects in process 2 is higher than that in process 1. The forming process of defects around the tool is analyzed in detail. It is found that the defects of process 1 are mainly formed and diffused before the tool, and the defects of process 2 are mainly formed and diffused before the tool and at the bottom of the tool. In stress analysis, it is found that the equivalent stress of process 2 is greater than that of process 1. The research has a certain reference value for nano-cutting process of gradient nano-crystalline copper.
Key words:  gradient nano-crystalline copper    cutting process    cutting force    detect    inner stress
               出版日期:  2019-11-25      发布日期:  2019-11-25
ZTFLH:  TB31  
基金资助: 国家自然科学基金(51535003),国家自然科学基金面上项目(51775146)
通讯作者:  ybguo@hit.edu.cn   
作者简介:  王子云,哈尔滨工业大学机电学院硕士研究生,研究方向为基于分子动力学的微纳切削仿真研究。
郭永博,哈尔滨工业大学机电工程学院教授,博导,工学博士,精密工程研究所所长助理。主持国家自然科学基金青年项目和面上项目、高档数控机床与基础制造装备04专项、921工程、中国博士后特别资助、中国博士后面上基金(一等)等纵向科研项目及多项载人航天、超高速风洞等横向科研项目,近五年负责在研经费约7000多万元。作为第一负责人获得黑龙江省科技进步二等奖、全国上银机械优秀博士论文奖、哈尔滨工业大学校优秀博士论文等。参与主编专著1部,申请国家发明专利10余项,授权10项。在Acta Materialia、Applied Physics Letters、Philosophical Magazine、《中国科学》《金属学报》等国内外著名期刊及欧洲精密工程与纳米技术EUSPEN、ASPEN等国际学术会议发表学术论文。
引用本文:    
王子云, 赵鹏越, 郭永博, 张凯, 王康. 梯度纳米多晶铜纳米切削过程的分子动力学仿真[J]. 材料导报, 2019, 33(Z2): 419-423.
WANG Ziyun, ZHAO Pengyue, GUO Yongbo, ZHANG Kai, WANG Kang. Simulation on Nano-cutting Process of Gradient Nano-crystalline Copper withMolecular Dynamics Method. Materials Reports, 2019, 33(Z2): 419-423.
链接本文:  
http://www.mater-rep.com/CN/  或          http://www.mater-rep.com/CN/Y2019/V33/IZ2/419
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