Kinetics of Epoxy Conductive Adhesive and Its Application
ZHANG Jin1,*, TAN Lu1, XING Baoyan1,2, LI Zuopeng1, ZHAO Jianguo1,2,*, QU Wenshan1, ZHANG Lu1
1 College of Chemistry and Chemical Engineering, Shanxi Datong University, Datong 037009, Shanxi, China 2 College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030000, China
Abstract: Carbon based epoxy conductive adhesive is widely used in electronic industry, and the study of its reaction kinetics has important theoretical and application significance. Curing kinetics of the conductive adhesive system was studied by non-isothermal differential scanning calorimeters (DSC). According to the Kissinger method, the apparent activation energy of the curing reaction was 57.6 kJ/mol. By the Starink isoconversion method for the conductive adhesive, the changes of activation energy (E) versus conversion (α) were obtained, and it was pointed out that the activation energy of the conductive adhesive increased with the increase of the conversion, but the average activation energy was close to 57.6 kJ/mol. The Sestal-Berggren (SB) autocatalytic kinetic model and E variable autocatalytic kinetic model were used to describe the curing reaction process of the studied system. Compared with the SB autocatalytic model, the E variable autocatalytic kinetic model showed a good agreement with experimental data of the conductive adhesive. The obtained model can be used in the calculation of the curing process of the conductive adhesive and provides theoretical guidance for the application of the conductive adhesive.
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