Regional Metallized Non-woven Fabric by Selective Printing Activation Solution and Electroless Plating
SUN Zhiping1,2,3, HUANG Junjun4
1 School of Intelligent Manufacturing, Changzhou Vocational Institute of Engineering, Changzhou 213164, China 2 School of Chemistry and Chemical Engineering, Southeast University, Nanjing 211189, China 3 Jiangsu Chenguang Paint Co., Ltd., Changzhou 213154, China 4 College of Materials and Chemical Engineering, Hezhou University, Hezhou 542899, China
Abstract: Aeasy method to prepare selective copper coating on non-woven fabric surface via selectively writing activated solution combined with electroless plating is demonstrated, the effects of plated time and temperature on structural and electrical properties of nickel coating were investigated systematically using thermogravimetric, X-ray diffraction, scanning electron microscop and X-ray photoelectron spectroscopy. Results showed that the surface structure of non-woven fabric could adsorb the silver ions, which used as catalyst for the selectively electroless copper plating. The activation energy of plating reaction was 23.37 kJ/mol. The selective and all-region copper coating could plate on non-woven fabric surface, leading to a excellent conductive, selective and bending properties. The plated coating could maintain 5B. When plated temperature increased from 40 ℃ to 80 ℃, deposited quantity increased from 1.38 g/g to 4.89 g/g, electrical resistivity reduced from 2 183 Ω·cm to 2×10-4 Ω·cm. When plated time increased from 10 min to 40 min, deposited quantity increased from 0.93 g/g to 3.55 g/g, electrical resistivity reduced from 1 006 Ω·cm to 6.5×10-3 Ω·cm.
1 Yang C, Wong C P, Yuen M M F. Journal of Materials Chemistry C, 2013, 1(26), 4052. 2 Sun D J, Yang J X, Ma G Z, et al. Materials Reports B: Research Papers, 2017, 31(12), 129(in Chinese). 孙东健, 杨建校, 马国芝,等. 材料导报:研究篇, 2017, 31(12), 129. 3 Li X, Wang G, Wang X, et al. Journal of Materials Chemistry A, 2013, 1(35), 10103. 4 Huang X, Dai B, Ren Y, et al. Journal of Materials Science Materials in Electronics, 2015, 26(4), 2584. 5 Wang Y, Wang Y, Chen J J, et al. Electrochimica Acta, 2016, 218, 24. 6 Huang J J, Sun Z P, Zhou F, et al. Journal of Materials Science Mate-rials in Electronics, 2017, 28, 10974. 7 Sun Z P, Huang J J, Wang L, et al. Journal of Materials Science Mate-rials in Electronics, 2015, 26(12), 10132. 8 Wang R M, Zheng S R, Zheng Y P. Polymer matrix composite material and process, Beijing Science Press, China, 2004(in Chinese). 王汝敏,郑水蓉,郑亚萍. 聚合物基复合材料及工艺, 北京科学出版社, 2004. 9 Yi L X, Heitmann J, Scholz R, et al. Applied Physics Letters, 2002, 81(22), 4248. 10 Sadeghzadeh-Attar A, Ayubikia G, Ehteshamzadeh M. Surface & Coa-tings Technology, 2016, 307, 837. 11 Sun X, Zhang L, Tao S, et al. Advanced Materials Interfaces, 2017, 4(14), 1700052. 12 Lu Y, Sathasivam S, Song J, et al. Science, 2015, 347(6226), 1132. 13 Chen Z, Xu X, Wong C C, et al. Surface & Coatings Technology, 2003, 167(2), 170. 14 Huang J J, Chen Z M, Zhou F, et al. Journal of Solid State Electrochemi-stry, 2017, 21, 1559. 15 Zhou Q, Chen H, Wang Y. Electrochimica Acta, 2010, 55(7), 2542. 16 Zhang T, Wang X, Li T, et al. Journal of Materials Chemistry C, 2014, 2(2), 2864. 17 Wang Y, Guo H, Chen J J, et al. ACS Applied Materials & Interfaces, 2016, 8, 26112. 18 Hou L, Lu Y, Zhao H. Journal of Materials Science Materials in Electro-nics, 2016, 27(7), 7318. 19 Sun Z P, Huang J J, Liu Q, et al. Journal of Materials Science Materials in Electronics, 2016, 27(6), 5892.
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2021, Vol. 35 
