Flexible Porous Polydimethylsiloxane Supported Nano Copper Sulfide for Efficient Solar Evaporation
SU Lifen1, CHANG Zhanpeng1, NING Yuying1, WANG Lu1, FANG Yahan1, FANG Binghu2,3, KE Yuchao2,3, YANG Bin1, XIA Ru1, QIAN Jiasheng1, MIAO Lei4
1 Anhui Province Key Laboratory of Environment-friendly Polymer Materials, School of Chemistry and Chemical Engineering, Anhui University, Hefei 230601, China 2 Anhui Zhongding Sealing Parts Co., Ltd., Ningguo 242300, China 3 Anhui Province Key Laboratory of High Performance Rubber Materials & Products, Ningguo 242300, China 4 School of Materials Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, China
Abstract: Interfacial solar evaporation is an efficient and cost-effective technology for water purification. Advanced photothermal conversion materials and micro thermal management are the key factors for efficient solar driven evaporation. The polydimethylsiloxane (PDMS) is an environmentally friendly, free design and flexible rubber, whose thermal conductivity can be improved by combination of different fillers. The nano copper sulfide (CuS) is a novel photothermal conversion material with nearly 100% absorption at near infrared. Here, a double porous layer of SiO2-PDMS/ PDMS-Al is synthesized by the template method with the cube sugar as template, nano silicone (SiO2) and aluminum powder works as the thermal insulating and conductive fillers, respectively. Then the nano CuS is attached on the skeletons of the PDMS-Al layer via the polyvinyl alcohol (PVA) to form the photothermal conversion material. The unique structure of the PDMS composites not only improves the hydrophilicity, but also has excellent absorption as 97.3%. The evaporation efficiency of the PDMS composites under 1 sun (1 kW/m2) is 77.03% with outstan-ding cycling stability. The PDMS photothermal composites reduce the heat loss during the interfacial evaporation process based on the microstructure, which provides a new strategy in seawater desalination and sewage treatment.
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2021, Vol. 35 
