Effect of Mg on the Microstructure and Properties of Sn-0.7Cu Solders
WANG Meng, ZHANG Guanxing, ZHONG Sujuan, CHENG Zhan, LI Wenbin
State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou 450001, China
Abstract: The effect of Mg element on the microstructure, melting characteristics, wettability and mechanical properties of Sn-0.7Cu eutectic solders were investigated. The results show that a proper addition of the Mg element refines the eutectic structure of the solders,while excessive addition results in the disappearance of the eutectic structure, and the transformation of Cu6Sn5 from fine particles to short rods. The melting point of the solders decreases significantly with the increasing addition of Mg element and it decreases to 222.58 ℃ with 1.0wt% Mg. The melting range increases and the degree of supercooling increases first and then decreases with the increasing addition of the Mg element. The wettability of sol-ders first increase and then decrease with the increase of Mg element. When the content of Mg element reaches to 0.1wt%, best wetting perfor-mance can be found with an spreading area of 85.74 mm2 and an increase by 4.37% compared with Sn-0.7Cu solder can be obtained. In addition, the microhardness of Sn-0.7Cu-xMg solder can significantly increase with the addition of the Mg element and reached the maximum value at 1.0wt% Mg, increasing by 17.2%.
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2021, Vol. 35 
