高导热金刚石/铜复合材料界面修饰研究进展

doi:10.11896/j.issn.1005-023X.2018.03.015

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Abstract

Diamond/copper composites with well-bonded interface have excellent thermophysical properties. Modified by various means, the diamond-copper interface can sufficiently enhance the thermal conductivity of diamond/copper composites. In this paper, recent progress about two main kinds of interfacial modification methods to prepare diamond/copper composite was reviewed, respectively as the preplating of carbide forming elements on diamond surface and pre-alloying of copper substrate. Preparation process and thermal conduction mechanism of these two modification methods were introduced briefly. The existing problems and development trend of diamond/copper composite preparation and interface modification were discussed.

Key words： diamond/copper composites interface modification thermal conductivity metal matrix composites

Published: 10 February 2018

CLC number:

TB333

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	Articles by authors
	Xiaoyu ZHANG
	Min XU
	Shengzhu CAO

Cite this article:

Xiaoyu ZHANG,Min XU,Shengzhu CAO. Research Progress on Interfacial Modification of Diamond/Copper Composites with High Thermal Conductivity[J]. Materials Reports, 2018, 32(3): 443-452.

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http://www.mater-rep.com/EN/10.11896/j.issn.1005-023X.2018.03.015 OR http://www.mater-rep.com/EN/Y2018/V32/I3/443

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