Numerical Simulation of WAAM Temperature Field Under Water Cooling
CHEN Kexuan1,2, WANG Xiangyu1,2, LI Yizhao1, CHEN Yanqiang1, DU Yinyin1
1 School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou 730050, China 2 State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology,Lanzhou 730050, China
Abstract: In order to solve the problem of serious heat accumulation caused by the poor heat dissipation condition of the substrate during the process of gas metal wire arc additive manufacturing (WAAM), the heat dissipation method of the substrate with water-cooling copper plate was used to improve the heat dissipation condition of the additive process. The temperature field change of additive manufacturing under the conditions of water cooling and without water cooling are simulated respectively using Abaqus software, and the simulation process is verified experimentally. The results show that the thermal cycle curve of the measurement point of the substrate under the experimental conditions is basically consistent with the simulation result. In both conditions with and without water cooling, the substrate temperature reached the maximum at the seventh layer, and the expanding of the high temperature area on the substrate was the largest. The cooling speed of the substrate under water cooling was much faster than that without water cooling, and the “double peak” effect was more obvious. When the first layer to the seventh layer are stacked, the average temperature gradient distribution of each layer with or without water cooling gradually decreases, but the former is always greater than the latter, and the volume of the molten pool continues to increase. During the seventh to tenth layers, the heat accumulation of the formed part is close to saturation, and it is most prone to severe collapse at this stage.
陈克选, 王向余, 李宜炤, 陈彦强, 杜茵茵. 水冷条件下WAAM温度场的数值模拟研究[J]. 材料导报, 2021, 35(4): 4165-4169.
CHEN Kexuan, WANG Xiangyu, LI Yizhao, CHEN Yanqiang, DU Yinyin. Numerical Simulation of WAAM Temperature Field Under Water Cooling. Materials Reports, 2021, 35(4): 4165-4169.
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2021, Vol. 35 
