Crystal Plasticity Modelling of Slip Activation and Strain Localization in a Copper Single Layer Crystal Under Foil Rolling
CHEN Shoudong1,2, LU Rihuan2, CHEN Zipan1, SUN Jian1, LI Jie1
1 School of Mechanical Engineering, Tongling University, Tongling 244061, China 2 State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110819, China
Abstract: Crystal plasticity finite element modelling of foil rolling prediction was crucial to validate and improve material models as well as to understand underlying plastic deformation mechanism in grain-scale. The deformation properties of foil rolling based materials depend strongly on the microstructure (grain boundary, slip system and orientation). Annealed single layer crystal copper foils were taken as raw materials, and after the processes of foil rolling was studied by experiment and crystal plasticity finite element simulation. The aim of this study was to model single and multiple slip activation and strain localization behavior of foil rolling of copper single layer crystal by using crystal plasticity finite element simulation, which taking into account the heterogeneous distribution of the shapes, grain boundaries and orientations of the grain. To accurately reproduce the initial grain morphology in the CPFEM simulation without assumptions regarding the sub-surface microstructure, a single layer crystal copper foil was used. In particular, it was shown that the heterogeneous distribution of the grain influences significantly the plastic deformation mechanism of single layer crystal copper foil rolling. The slip activation and deformation at grain boundary were significantly different from the interior and surface grain. A single layer crystal slip was markedly heterogeneous, gives rise to form local slip band and strain localization, with rolling reduction driving strong variations, correctly captured by the model. Remarkable variations of slip activation and plastic strain occur between locations either side of grain boundaries, providing appropriate opportunities for sub-grain and micro-crack nucleation.
作者简介: 陈守东,铜陵学院机械工程学院副教授、博士。2010年7月本科毕业于铜陵学院机械工程学院,2016年7月在东北大学轧制技术及连轧自动化国家重点实验室材料加工工程取得博士学位,2018年1月至今在昆明理工大学进行博士后研究工作。主要从事晶体塑性有限元和热障涂层体系设计及第一性原理计算的研究工作,以第一作者身份在International Journal of Mechanical Sciences、Transactions of Nonferrous Metals Society of China、《金属学报》中英文版等SCI学术期刊发表研究论文40余篇,申请国家发明专利4项,其中授权2项。
引用本文:
陈守东, 卢日环, 陈子潘, 孙建, 李杰. 轧制单层晶铜箔滑移启动和应变局部化的晶体塑性模拟[J]. 材料导报, 2021, 35(4): 4170-4176.
CHEN Shoudong, LU Rihuan, CHEN Zipan, SUN Jian, LI Jie. Crystal Plasticity Modelling of Slip Activation and Strain Localization in a Copper Single Layer Crystal Under Foil Rolling. Materials Reports, 2021, 35(4): 4170-4176.
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2021, Vol. 35 
