Effect of Cutting Depth on Subsurface Defects and Residual Stress in Single Crystal γ-TiAl Alloy
WANG Qi1,2, FENG Ruicheng1,2,*, FAN Lihe1,2, SHAO Zihao1,2, DONG Jianyong1,2
1 School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou 730050, China 2 Key Laboratory of Digital Manufacturing Technology and Application, Ministry of Education Lanzhou University of Technology, Lanzhou 730050, China
Abstract: In this paper, the molecular dynamics method was used to simulate the cutting process of single crystal γ-TiAl alloy under different cutting depths. The evolution of microscopic defects and the evolution of internal stress after stable cutting at different depths of cutting was analyzed, and the distribution of residual stress and von Mises stress at different cutting depths were studied, the relationship between the evolution of microscopic defects and internal stress at different cutting depths was discussed. The results show that the dislocation reaction and the stacking fault evolution increase with the increase of cutting depth, and the dislocation reaction has a great influence on the formation of the Lomer-Cottrell dislocation. The residual compressive stress formed by the surface of the tool extrusion workpiece is affected by the stacking fault evolution and dislocation reaction, and the severity of the dislocation reaction affects the internal stress. The residual compressive stress exists on a certain depth of the subsurface. It is also found that the change of cutting depth had little effect on von Mises stress.
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