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材料导报  2020, Vol. 34 Issue (18): 18131-18134    https://doi.org/10.11896/cldb.19100206
  金属与金属基复合材料 |
单晶高温合金过渡液相扩散焊等温凝固动力学研究
柴禄, 侯金保, 郎波
中国航空制造技术研究院,航空焊接与连接技术航空科技重点实验室,北京 100024
Isothermal Solidification Kinetics During Transient Liquid Phase Diffusion Bonding of Single Crystal Superalloy
CHAI Lu, HOU Jinbao, LANG Bo
Aeronautical Key Laboratory for Welding and Joining Technologies, AVIC Manufacturing Technology Institute, Beijing 100024, China
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摘要 针对航空发动机对单晶高温合金叶片高性能焊接技术的需求,采用镍基非晶箔带KNi3A对IC9单晶高温合金进行过渡液相(TLP)扩散焊接。利用扫描电镜观察接头组织,分析了工艺参数对接头组织的影响,阐明了温度对接头凝固动力学的影响机制。结果表明:温度升高一方面可以提高溶质扩散系数,另一方面会减小界面处固相中溶质浓度梯度,使扩散速率随温度升高先增大后减小,从而使凝固完成时间随温度升高先缩短后延长。研究成果可为单晶叶片焊接提供必要的理论依据,对航空发动机制造技术发展有一定的借鉴意义。
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柴禄
侯金保
郎波
关键词:  IC9  过渡液相扩散焊  凝固动力学    
Abstract: Based on the requirement of advanced joining technology of single crystal superalloy blades, the transient liquid phase diffusion of IC9 single crystal superalloy was carried out with nickel base amorphous foils KNi3A. SEM (scanning electron microscopy) was used to observe the microstructures of the joints. The effects of bonding parameters on microstructure were studied. Influence mechanism of temperature on isothermal solidification kinetics was expounded. Results show that, solute diffusion coefficient increases and solute concentration gradient decreases with the increasing of temperature at the same time. Solute diffusion rate firstly increases and then decrease, and then result in solidification time initially decrease and then increase with temperature increasing. The research results can provide the necessary theoretical basis for joining of single crystal blades and have certain guiding significance for the field of aviation manufacturing.
Key words:  IC9    transient liquid phase diffusion bonding    solidification kinetics
                    发布日期:  2020-09-12
ZTFLH:  TG454  
通讯作者:  chailu408446026@163.com   
作者简介:  柴禄1985年生,中国航空制造技术研究院高级工程师,主要从事航空材料先进连接技术研究。
引用本文:    
柴禄, 侯金保, 郎波. 单晶高温合金过渡液相扩散焊等温凝固动力学研究[J]. 材料导报, 2020, 34(18): 18131-18134.
CHAI Lu, HOU Jinbao, LANG Bo. Isothermal Solidification Kinetics During Transient Liquid Phase Diffusion Bonding of Single Crystal Superalloy. Materials Reports, 2020, 34(18): 18131-18134.
链接本文:  
http://www.mater-rep.com/CN/10.11896/cldb.19100206  或          http://www.mater-rep.com/CN/Y2020/V34/I18/18131
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