Effect of Tool Rake Angle on Microstructure and Properties of Ultrasonic Compound Machining Formed Chip
SUN Haimeng1, NIU Ying1,2,*, JIAO Feng1, WANG Zhuangfei1
1 School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454003, Henan, China 2 Xixia County Internal Combustion Engine Intake and Exhaust Pipe Limited Liability Company, Nanyang 474500, Henan, China
Abstract: Ultrafine grained pure copper as an important basic material and functional material has become the current research hotspot of metal mate-rials. In this work, ultrasonic compound cutting was proposed to prepare ultrafine grained pure copper based on large strain extrusion machining. In UCC, the tool rake angle is the key factor affecting chip strain, grain size, dislocation density and properties. In order to study the effect of tool rake angles on the microstructure and properties of pure copper chip. A 3D Finite element analysis(FEM) model of ultrasonic compound cutting was established based on ABAQUS analysis software, and the change of equivalent strain, equivalent strain rate and cutting temperature in the shear deformation zone were analyzed. Single-factor tests were designed to analyze the effects of tool rake angle and ultrasonic vibration on chip microstructure, dislocation density and micro-hardness. The results show that:With the increase of tool rake angle, the equal strain and the cutting temperature gradually decrease, the equal strain rate first increases and then decreases. Compared with LSEM chip, the grain refinement degree and dislocation density of chip has be improved after adding ultrasonic vibration, and the hardness also increase by 5%. When the tool rake angle is 30°, the chip grain is refined from coarse grain to submicron elongated grain, and the macro-hardness is increased from 92.5HV to 131.8HV; when the tool rake angle is 15°, the grain is further refined into equiaxed fine grain, the dislocation density is 1.14×1013 m-2 and the hardness is also increased to 184.3HV. At this time, the hardness of pure copper chips conforms to the Hall-Petch relationship.
1 Zhang J W, Shi F J, Ye S Z, et al. Forging & Stamping Technology, 2020, 45(4), 21(in Chinese). 张健伟, 石凤健, 叶思珍, 等. 锻压技术, 2020, 45(4), 21. 2 Jiao F, Sun H M, Niu Y, et al. Surface Technology, 2022, 51(4), 37(in Chinese). 焦锋, 孙海猛, 牛赢, 等. 表面技术, 2022, 51(4), 37. 3 Zhang S P, Wang J L, Zhang Z W, et al. Transactions of Materials and Heat Treatment, 2020, 41(3), 1(in Chinese). 张苏鹏, 王军丽, 章震威, 等. 材料热处理学报, 2020, 41(3), 1. 4 Xue K M, Liu M, Ding Y G, et al. China Mechanical Engineering, 2018, 29(13), 1627(in Chinese). 薛克敏, 刘梅, 丁永根, 等. 中国机械工程, 2018, 29(13), 1627. 5 Rahmatabadi D, Shahmirzaloo A, Hashemi R, et al. Materials Research Express, 2019, 6(8), 86542. 6 Chen C H, Jiang L Y, Liu C L, et al. Materials Reports, 2019, 33(8), 1367(in Chinese). 陈琛辉, 蒋璐瑶, 刘成龙, 等. 材料导报, 2019, 33(8), 1367. 7 Brown T L, Saldana C, Murthy T G, et al. Acta Materialia, 2009, 57(18), 5491. 8 Chiffre L D. International Journal of Machine Tool Design and Research, 1976, 16, 137. 9 Sun H M, Jiao F, Niu Y, et al. The International Journal of Advanced Manufacturing Technology, 2022, 120 (9-10), 5763. 10 Mert E, Wilfredo M, Kevin P T, et al. Acta Materialia, 2012, 60(5), 2031. 11 Zou Z J, Wu B X, Liu L W. Heat Treatment of Metals, 2018, 43(1), 121(in Chinese). 邹志杰, 吴邦晛, 刘良伟. 金属热处理, 2018, 43(1), 121. 12 Sharma V K, Kumar V, Singh J R. Machining Science and Technology, 2020, 24(1), 42. 13 Deng W J, He Y T, Lin P, et al. Materials and Manufacturing Processes, 2014, 29(5), 621. 14 Swaminathan S, Shankar M R, Lee S, et al. Materials Science and Engineering A, 2005, 410, 358. 15 Zhang S N, Pan L W, Luo T, et al. Materials Reports, 2018, 32(14), 2452(in Chinese). 张赛楠, 潘利文, 罗涛, 等. 材料导报, 2018, 32(14), 2452. 16 Peng Z L, Zhang X Y, Zhang D Y. Ultrasonics, 2020, 111, 106340. 17 Yang D Q, Wang X W, Peng Y, et al. Materials Reports, 2022, 36(1), 126 (in Chinese). 杨东青, 王小伟, 彭勇, 等. 材料导报, 2022, 36(1), 126. 18 Lin Q, Xie P C, Hu J B, et al. Acta Physica Sinica, 2021, 70(20), 113(in Chinese). 林茜, 谢普初, 胡建波, 等. 物理学报, 2021, 70(20), 113. 19 Johnson G R, Cook W H. Engineering Fracture Mechanics, 1985, 21(1), 31. 20 Tugrul Özel. International Journal of Machine Tools and Manufacture, 2005, 46(5), 518. 21 Wang P H, Yue X J, Zong C G, et al. Vacuum, 2021, 192, 110396. 22 Niu Y, Jiao F, Zhao B, et al. Journal of Mechanical Engineering, 2019, 55(13), 224(in Chinese). 牛赢, 焦锋, 赵波, 等. 机械工程学报, 2019, 55(13), 224. 23 Williamson G K, Smallman R E. Philosophical Magazine, 1956, 1(1), 34. 24 Xu S J, Shi C S, Zhao N Q, et al. Acta Physica Sinica, 2012, 61(11), 391(in Chinese). 徐树杰, 师春生, 赵乃勤, 等. 物理学报, 2012, 61(11), 391. 25 Hall E O. Proceedings of the Physical Society. Section B, 1951, 64(9), 747. 26 Ye C, Sergey S, Dong L, et al. Journal of Applied Physics, 2014, 115(21), 213519.
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2023, Vol. 37 
