Abstract: A series of bismuth-ion-doped SrTiO3 thin films were deposited on p+-Si substrates via a sol-gel process and the subsequent rapid annealing technique, to fabricate the sandwich structures of Ag/Sr1-xBixTiO3/p+-Si for resistance-switching device. The effects of Bi-ion doping concentration on microstructure of the thin film, and resistance switching behavior of Ag/Sr1-x-BixTiO3/p+-Si devices were investigated. The results showed that a low amount of Bi causes no change in the phase structure of Sr1-xBixTiO3 thin films, but an obvious increment of grain size can be observed with the increasing Bi doping content. The Bi4SrTi4O15 and TiO2 phases will form when the doping amount is x=0.16. All of the Ag/Sr1-xBixTiO3/p+-Si devices exhibit bipolar resistive and multi-level resistance switching behaviors. The increasing Bi doping concentration also leads to a biphasic (increase→decrease) change in the device’s resistance switching property;when x=0.12 the device shows the maximum high/low resistance ratio of 105 and better reading endurance after 2 000 cycles, but the device performance decays while x=0.16. This can be explained by the change of dominant conduction mechanism under HRS (high resistance state) induced by Bi doping, from space charge limited current (SCLC) (x<0.16) to Schottky barrier emission (x=0.16). All the devices conduct current in accordance with the filamentary theory under LRS (low resistance state).
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