Abstract: Flexible electronic devices, which are characterized by stretchability and bendability, have attracted tremendous interests because of their great application potential in the fields of information, medicine, energy and so on. Functional oxide thin-film materials have become an important research object in physics and materials science due to their rich electrical, magnetic, optical and unique multi-field coupling properties, and wide usage in the electronic and optoelectronic devices. With more and more devices being introduced to various complex curved surfaces and contact with human or human tissue, the demand for flexible oxide film devices such as stretchability and bendability is becoming more and more urgent. Due to the high temperature required for the growth of high-quality oxide films and the critical requirements for the interface control between the substrate and the film, the integration of oxide films with the stretchable and flexible substrates faces huge challenges. To deposit the oxide film directly on a flexible metal foil or a polymer substrate, it is necessary to overcome the difficulties of controlling the interface between the metal substrate and the film or the poor tolerance of the polymer substrate to the growth temperature. After depositing functional oxide films on rigid substrates, peeling and transferring thin films to a stretchable and flexible substrate is another solution. But the challenge is how to peel the film controllably and completely from the growth substrate. In response to this challenge, the chemical transfer printing technology by etching sacrificial layer and the physical stripping method by van der Waals epitaxy or laser stripping were developed. In this paper, the development of flexibility oxide thin film devices in recent years is reviewed. Main flexibility strategies are summarized, including direct growth on flexible substrates such as metal substrates and polymer substrates, and transfer-printing after chemical etching or physical stripping.The advantages and limits of these strategies are analyzed. The challenges and opportunities in the fabrication of flexible oxide thin film devices are summarized.
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