Study on Chemical Deposition Technology of Conductive Metal Layer on Polyimide Film Surface
WANG Nan1,*, BAI Jingying1,2, LI Jiafeng1, FENG Li1, XU Junjie1, HE Yanlong1, DONG Junwei1, CUI Qingxin1, ZHANG Ligong1
1 Beijing Spacecrafts, China Academy of Space Technology, Beijing 100094, China 2 Xingchi Hengdong Technology Development Co., Ltd., Beijing 100090, China
Abstract: In order to make the polyimide (PI) film material have good surface conductivity and meet its application in aerospace fields, like radar antenna, the highly chemically inert PI material on the surface was modified by alkaline etching, and the metal layers on the surface of PI film were then deposited by electroless copper plating technology. The microstructure of the PI film before and after surface modification, as well as properties of surface metal layer on PI film was characterized by SEM, XRD, AFM, FTIR and so on. After alkaline etching at room temperature, there is a staggered and evenly distributed protrusion morphology with dendritic and rivet structures on the surface of PI. However, the PI film surface etched at 60 ℃ presents pits with different sizes and depths of etching holes, and the hydrophilicity of the PI film surface is enhanced after etc-hing. The metal layers on the surface of PI film behave uniform and dense, with good conductivity and good adhesion with PI film substrate. The staggered protrusion structure on the surface of PI film after modification provides a good deposition and intercalation junction point for the nucleation and crystallization of the metal layer on the surface of PI film, forming a superior interface interlock between the metal layers and the PI substrate, so as to benefit the metal layer with high bonding force on the surface of PI film. This work realizes the preparation of metal layer with high conductivity and superior bonding force on the PI surface under alkaline etching, and can provide technical support for the application of polyimide in aerospace fields.
王楠, 白晶莹, 李家峰, 冯立, 徐俊杰, 赫艳龙, 董俊伟, 崔庆新, 张立功. 聚酰亚胺薄膜表面导电金属层化学沉积技术研究[J]. 材料导报, 2022, 36(22): 22030280-6.
WANG Nan, BAI Jingying, LI Jiafeng, FENG Li, XU Junjie, HE Yanlong, DONG Junwei, CUI Qingxin, ZHANG Ligong. Study on Chemical Deposition Technology of Conductive Metal Layer on Polyimide Film Surface. Materials Reports, 2022, 36(22): 22030280-6.
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2022, Vol. 36 
