Abstract: Fan-out wafer level packaging (FOWLP) has attracted much attention due to the more optimized solution in cost, size, input/output density, etc. With the thinning of the package thickness, photosensitive polyimide utilized as the dielectric material in redistribution layer needs to fulfill new demanding tasks: lower dielectric constant, lower coefficient of thermal expansion, lower residual stress, lower curing temperature, etc. The main problem faced by FOWLP is wafer warpage. Reducing the thermal budget in packaging process can effectively minimize the stress concentration caused by the difference in thermodynamic properties between the metal and dielectric layers. Therefore, the primary problem to be solved for photosensitive polyimide is avoiding the restriction of curing temperature (>300 ℃) in the conventional system. In this review, the recent research progress and development status in reducing the curing temperature of photosensitive polyimide are summarized from the perspective of polyimide synthesis process. The advantages and disadvantages of low-temperature curing systems based on polyamic acid, polyisoimide and soluble polyimide are introduced. Finally, the further development trend of low-temperature curing system is prospected.
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2022, Vol. 36 
