光敏聚苯并噁唑的研究现状与发展趋势

doi:10.11896/cldb.19080186

材料导报

2020, Vol. 34

Issue (19): 19183-19189 https://doi.org/10.11896/cldb.19080186

高分子与聚合物基复合材料

光敏聚苯并噁唑的研究现状与发展趋势

王涛^1,2, 李金辉¹, 赵雅绪², 朱良², 张少霞², 张国平^1,, 孙蓉¹, 汪正平³

1 中国科学院深圳先进技术研究院,深圳先进电子材料国际创新研究院,深圳 518055
2 中国科学院大学,北京 100049
3 佐治亚理工学院材料科学与工程学院,亚特兰大 30332

Research Status and Development Trend of Photosensitive Polybenzoxazole

WANG Tao^1,2, LI Jinhui¹, ZHAO Yaxu², ZHU Liang², ZHANG Shaoxia², ZHANG Guoping¹, SUN Rong¹, WONG Chingping³

1 Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
2 University of Chinese Academy of Sciences, Beijing 100049, China
3 School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta 30332, United States

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摘要作为耐热光敏绝缘介质材料的典型代表之一,光敏聚苯并噁唑(PSPBO)具有优异的力学性能、耐热性能、绝缘性能、低吸水率、低介电常数及突出的光刻成型能力,被广泛应用于微电子、航空航天等重要领域。特别地,在集成电路半导体封装中,光敏聚苯并噁唑被广泛应用于层间介质材料、应力缓冲层及保护层等,是扇出型封装等先进制程的关键材料。另外,随着5G高频高速通信、柔性显示、OLED等领域的快速发展,产业界对该类材料提出了更高的要求,比如低温固化、高粘结强度、低介电常数、导热等。更为重要的是,我国尚未掌握该材料的核心技术。本文综述了光敏聚苯并噁唑的发展概况和最新的研究进展,包括正性光敏聚苯并噁唑、负性光敏聚苯并噁唑以及光敏聚苯并噁唑的应用发展,最后对其发展前景进行了展望,以期为我国光敏聚苯并噁唑等耐热光敏聚合物基础研究与产业应用提供参考。

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	王涛
	李金辉
	赵雅绪
	朱良
	张少霞
	张国平
	孙蓉
	汪正平

关键词: 耐热光敏聚合物光敏聚苯并噁唑低温固化介电半导体封装

Abstract: As one of the typical thermal stable photosensitive dielectric materials, photosensitive polybenzoxazole (PSPBO) exhibits excellent mechanical properties, heat resistance, insulation properties, low water absorption, low dielectric constant and outstanding lithographic properties. It has been widely used in some key areas such as microelectronics and aerospace. In particular, PSPBO is widely employed in interlayer dielectric materials, stress buffer layers and protective layers in integrated circuit semiconductor packaging, being a key material for advanced processes in fan-out packaging. On the other hand, with the rapid development of 5G high-frequency and high-speed communication, flexible display and OLED et al., higher requirements of low temperature curing, high adhesive strength, low dielectric constant, and thermal conductivity have been raised. More importantly, core technology of PSPBO is absent in China. This mini-review describes the development of PSPBO, including positive-working PSPBO, negative-working PSPBO and the development of their applications. At the same time, some novel development prospects are prospected. We hope that this mini-review could provide useful information to Chinese researchers for the basic research and industrial applications of PSPBO.

Key words: thermal stable and photosensitive polymer photosensitive polybenzoxazole low temperature curing dielectric semiconductor package

发布日期: 2020-11-05

ZTFLH:

TQ572

基金资助: 深圳市基础研究项目(JCYJ20160331191741738);国家自然科学基金-广东省联合基金(U1601202);国家自然科学基金-深圳市机器人联合基金(U1613215);中国博士后科学基金(2018M640840);科技部国家重点研发项目(2017ZX02519);国家自然科学基金(61904191)

通讯作者: gp.zhang@siat.ac.cn

作者简介: 王涛,2018年6月毕业于合肥工业大学应用化学专业,获得理学学士学位。现为中国科学院深圳先进技术研究院硕士研究生,在张国平研究员的指导下进行研究。目前主要研究领域为光敏聚酰亚胺和聚苯并噁唑材料。
李金辉,博士,中国科学院深圳先进技术研究院博士后/助理研究员。2017年博士毕业于中国科学院大学,获得材料学博士学位。2017年8月至2018年7月在香港城市大学(中国)材料科学与工程系从事博士后研究工作。2018年8月入职深圳先进技术研究院,主要从事“面向5G通信的晶圆级扇出型封装光敏聚酰亚胺材料研究”。李金辉博士长期从事聚合物合成和应用研究,以第一作者(等同第一作者或通信作者)发表论文17篇,h-index: 15 (扣除自引h-index: 13),包括:J. Mater. Chem. A、ACS Appl. Mater. Interfaces、J. Mater. Chem. C、Chem. Eur. J.、Pol-ymer、J. Power Sources、J. Appl. Polym. Sci等国际高水平SCI期刊,并在MRS和ECTC等国际顶级材料和电子封装会议上进行口头报告并发表EI收录会议论文。申请国家发明专利12件。目前作为项目主持人获得了国家自然科学基金(61904191)、中国博士后科学基金面上项目一等资助(2018M640840)和深圳先进技术研究院优秀青年基金创新项目 (Y6G015)等基金支持。
张国平,中国科学院深圳先进技术研究院研究员,湖南大学应用化学博士,中国科学院深圳先进研究院材料科学与工程研究所(筹),深圳市先进电子材料国际创新研究院副院长,先进电子封装材料国家地方联合工程实验室副主任。先后前往美国佐治亚理工学院和香港中文大学开展访问学者研究,合作导师汪正平院士。自2015年起任IEEE学会会员。目前已在Small、Carbon、J. Mater. Chem.等材料专业期刊上发表SCI/EI收录学术论文70余篇,累计获得科研经费2 000余万元。科研成果转化方面,共有5件专利作价600万元实现产业化转移,并作为创始人成立晶圆级封装高端电子材料公司——深圳市化讯半导体材料有限公司。先后多次荣获深圳先进院优秀个人、创业之星等荣誉。主要研究方向为晶圆级封装关键材料。

引用本文:

王涛, 李金辉, 赵雅绪, 朱良, 张少霞, 张国平, 孙蓉, 汪正平. 光敏聚苯并噁唑的研究现状与发展趋势[J]. 材料导报, 2020, 34(19): 19183-19189.
WANG Tao, LI Jinhui, ZHAO Yaxu, ZHU Liang, ZHANG Shaoxia, ZHANG Guoping, SUN Rong, WONG Chingping. Research Status and Development Trend of Photosensitive Polybenzoxazole. Materials Reports, 2020, 34(19): 19183-19189.

链接本文:

http://www.mater-rep.com/CN/10.11896/cldb.19080186 或 http://www.mater-rep.com/CN/Y2020/V34/I19/19183

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