Effect of Cooling Method on Interface Microstructure of Cu/Al Clad Sheet by Solution Treatment
LIU Yujie1, JIANG Xianquan1, SHE Xinwei1,2, WANG Puquan3, RAN Yang4, PENG He3, RAN Zhende5
1 College of Materials and Energy, Southwest University, Chongqing 400715, China 2 Advanced Materials Research Center, Chongqing Academy of Science and Technology, Chongqing 401123, China 3 College of Engineering and Technology, Southwest University, Chongqing 400715, China 4 Chongqing Institute of Optics and Mechanics, Chongqing 401122, China 5 Chongqing Gearbox Co., Ltd., Chongqing 402260, China
Abstract: The effect of cooling mode (water cooling, air cooling, furnace cooling) on the interface microstructure of Cu/Al clad sheet was studied by means of optical microscopy, scanning electron microscopy and X-ray diffraction. And the effect of cooling mode on the mechanical properties of cast rolled Cu/Al clad sheet was tested by microhardness testers. The experimental results indicate that five kinds of intermetallic compounds, i. e. Al2Cu, AlCu, Al2Cu3, Al4Cu9, AlCu3 were formed at the interface layer after solution treatment at 500 ℃×2 h. There can be found holes in the diffusion layers after water cooling and air cooling, but nearly no holes on the interface after furnace cooling. The reason of holes forming and the change process of holes were studied. The defects such as holes will weaken the bonding strength of interface layer. The interfacial diffusion layer of the as-cast and rolled sheet is thin and the hardness is low. After solution treatment the thickness and hardness will be increased, and a lower cooling rate can result in a thicker and harder diffusion layer. During the stripping process, the cast and rolled sheet fractured near the Al matrix, and the solution-treated sheet fractured at the interface diffusion layer. With the decrease of the cooling rate, the crack propagation ability gets weaken, which indicates that excessively thick intermetallic compounds are not conducive to the combination of the clad sheet.
通讯作者:
蒋显全,西南大学材料与能源学院二级教授、博导。1992年获中南工业大学硕士学位,2006年获四川大学博士学位,在Electrochimica Acta、Journal of Alloys and Compounds、Materials and Design、Materials Science & Engineering A等杂志发表论文75篇,其中被SCI和EI收录51篇;申请专利71项;获省部级科技奖励一等奖2项,二等奖4项,三等奖4项,其他科技奖励若干。jsq89@swu.edu.cn
刘玉洁, 蒋显全, 佘欣未, 王浦全, 冉洋, 彭和, 冉贞德. 固溶处理冷却方式对Cu/Al复合板界面微观组织的影响[J]. 材料导报, 2020, 34(10): 10132-10137.
LIU Yujie, JIANG Xianquan, SHE Xinwei, WANG Puquan, RAN Yang, PENG He, RAN Zhende. Effect of Cooling Method on Interface Microstructure of Cu/Al Clad Sheet by Solution Treatment. Materials Reports, 2020, 34(10): 10132-10137.
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