苯基硅橡胶泡沫的制备及阻尼性能

doi:10.11896/cldb.18090240

材料导报

2019, Vol. 33

Issue (10): 1752-1755 https://doi.org/10.11896/cldb.18090240

高分子与聚合物基复合材料

苯基硅橡胶泡沫的制备及阻尼性能

胡洋¹, 赵祺², 芦艾^1,2, 王志勇¹, 沈思敏¹

1 西南科技大学材料科学与工程学院,绵阳 621010
2 中国工程物理研究院化工材料研究所,绵阳 621900

Preparation and Damping Properties of Phenyl Silicone Rubber Foam

HU Yang¹, ZHAO Qi², LU Ai^1,2, WANG Zhiyong¹, SHEN Simin¹

1 School of Materials Science and Engineering,Southwest University of Science and Technology,Mianyang 621010
2 Institute of Chemical Materials,China Academy of Engineering Physics,Mianyang 621900

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摘要本工作采用化学发泡法制备了苯基硅橡胶泡沫材料,探究了苯基硅橡胶硫化发泡过程的动力学,研究了苯基硅橡胶体系在引入泡沫结构后的阻尼性能。结果表明,通过调整硫化加工温度和发泡剂用量,可以制备不同密度、泡孔尺寸的苯基硅橡胶泡沫材料,泡沫材料的阻尼性能明显优于实心胶,其中,孔径约为100 μm密度ρ为0.74 g/cm³的苯基硅橡胶泡沫的有效阻尼温域比实心胶提高了47 ℃,阻尼峰值提高了14%。

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关键词: 苯基硅橡胶泡沫动力学阻尼性能

Abstract: The phenyl silicone rubber foam was prepared by chemical foaming method. The kinetics of phenyl silicone rubber in the vulcanization foaming process was investigated. The damping properties of the phenyl silicone rubber system with foam structure were studied. The phenyl silicone rubber foam with different cell and density can be prepared by adjusting the vulcanization processing temperature and the amount of foaming agent. The damping property of the foam is obviously better than that of the solid rubber. The effective damping temperature range of the phenyl silicone rubber foam with cell diameter of about 100 μm and density of 0.74 g/cm³ is 47 ℃ higher than that of the solid rubber, and the damping peak is increased by 14%.

Key words: phenyl silicone rubber foam dynamics damping property

出版日期: 2019-05-25 发布日期: 2019-05-16

ZTFLH:

TQ333.93

通讯作者: zq0611@sina.com

作者简介: 胡洋,现就读于西南科技大学,师承芦艾老师、赵祺老师。于2017年3月至今在中国工程物理研究院化工材料研究所联合培养学习,主要从事高阻尼硅橡胶泡沫材料的研究。赵祺,于北京理工大学取得博士学位,现为中国工程物理研究院化工材料研究所副研究员,主要从事高分子材料研究工作。

引用本文:

胡洋, 赵祺, 芦艾, 王志勇, 沈思敏. 苯基硅橡胶泡沫的制备及阻尼性能[J]. 材料导报, 2019, 33(10): 1752-1755.
HU Yang, ZHAO Qi, LU Ai, WANG Zhiyong, SHEN Simin. Preparation and Damping Properties of Phenyl Silicone Rubber Foam. Materials Reports, 2019, 33(10): 1752-1755.

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http://www.mater-rep.com/CN/10.11896/cldb.18090240 或 http://www.mater-rep.com/CN/Y2019/V33/I10/1752

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