镀银铜纳米颗粒的制备与应用研究进展

材料导报

2022, Vol. 36

Issue (Z1): 21090201-4

金属与金属基复合材料

镀银铜纳米颗粒的制备与应用研究进展

陈杰, 樊正阳, 毛华明, 尹俊刚, 李耀, 代伟, 杨宏伟

昆明贵金属研究所稀贵金属综合利用新技术国家重点实验室,昆明 650106

Progress in the Preparation and Application of Silver-plated Copper Nanoparticles

CHEN Jie, FAN Zhengyang, MAO Huaming, YIN Jungang, LI Yao, DAI Wei, YANG Hongwei

State Key Laboratory of Advance Technologies for Comprehensive Utilization of Precious Metals, Kunming Institute of Precious Metals, Kunming 650106, China

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摘要镀银铜纳米颗粒由于具有优异的导电性又能有效抗氧化且性价比高,现已广泛用于多个领域。本文首先介绍了镀银铜纳米颗粒的制备方法,包括置换法、还原法、复合法、机械球磨法和熔融雾化法等,并讨论了制备过程的控制机理;然后,探讨了其在导电胶、电磁屏蔽涂料和导电油墨等领域的应用。最后,对镀银铜纳米颗粒的合成与应用进行了展望。

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关键词: 镀银铜纳米颗粒制备方法导电填料导电应用

Abstract: Silver-plated copper nanoparticles have been widely used in many fields because of their excellent electrical conductivity, effective oxidation resistance and high cost performance. This article first introduces the preparation methods of silver-plated copper nanoparticles, including displacement method, reduction method, composite method, mechanical ball milling method and melting atomization method, etc. The control mechanism of the preparation process is discussed. Then,their applications in conductive adhesives, electromagnetic shielding coatings and conductive inks are discussed. Finally, the synthesis and application of silver-plated copper nanoparticles are prospected.

Key words: silver-coated copper nanoperticles preparation method conductive filler conductive application

出版日期: 2022-06-05 发布日期: 2022-06-08

ZTFLH:

O648

基金资助: 国家自然科学基金(21761016);云南省重大研发专项(202002AB080001-1; 202102AB080008-5);云南省中青年学术与技术带头人后备人才项目(2017HB060);云南省万人计划-青年拔尖人才项目

通讯作者: nanolab@ipm.com.cn

作者简介: 陈杰,2019年6月毕业于内江师范学院,获得学士学位。现为昆明贵金属研究所研究生,在杨宏伟研究员的指导下进行研究工作。目前主要研究方向为贵金属纳米材料。
杨宏伟,2012年7月毕业于厦门大学,物理化学专业,获得博士学位。现任昆明贵金属研究所研究员。重点研究贵金属纳米材料的制备、表征以及应用研究。

引用本文:

陈杰, 樊正阳, 毛华明, 尹俊刚, 李耀, 代伟, 杨宏伟. 镀银铜纳米颗粒的制备与应用研究进展[J]. 材料导报, 2022, 36(Z1): 21090201-4.
CHEN Jie, FAN Zhengyang, MAO Huaming, YIN Jungang, LI Yao, DAI Wei, YANG Hongwei. Progress in the Preparation and Application of Silver-plated Copper Nanoparticles. Materials Reports, 2022, 36(Z1): 21090201-4.

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http://www.mater-rep.com/CN/ 或 http://www.mater-rep.com/CN/Y2022/V36/IZ1/21090201

1 Lee J W, Han G Y, Lee D S, et al. Small, 2018, 14(8), 1703312.
2 Muhamad A J, Nazish S, Muhammad R, et al. Materials Today Procee-dings, 2021, 47(supplement), S55.
3 Young M C, Sang S L, Chong R P, et al. Composites Part A, 2021, 149, 106562.
4 Andritsosa K, Theodorakosa I, Zacharatosa F, et al. Applied Surface Science, 2020, 506, 144968.
5 Artur J M, Aman D. Materials for Renewable and Sustainable Energy, 2018, 7(3), 195.
6 Peng J, Chen B, Wang Z C, et al. Nature, 2020, 586(7829), 390.
7 Wang W, Wang M, Ambrosi E, et al. Nature Communications, 2019, 10, 81.
8 余凤斌, 郭涵, 曹建国. 电镀与环保, 2011, 31(6), 26.
9 Alexander I T, Olga A L, Alexander M V, et al. Materials Today Proceedings, 2020, 25(3), 447.
10 Huang H J, Wu X, Ma X, et al. In: 20th International Conference on Electronic Packaging Technology. Hong Kong, China, 2019, pp. 245273.
11 武博, 朱晓云, 曹梅, 等. 材料研究学报, 2018, 32(10), 775.
12 Zhang Y, Zhu L P, Li G, et al. Applied Materials & Interfaces, 2019, 11(8), 8382.
13 Dai X F, Xu W, Zhang T, et al. Chemical Engineering Journal, 2019, 364, 310.
14 Sakthisabarimoorthi A, Jose M, Dhas S A M B, et al. Journal of Mate-rials Science: Materials in Electronics, 2017, 28(6), 4545.
15 Gaurav A K, Chang Y, Wojciech T O. The Journal of Physical Chemistry Letters, 2020, 11(13), 5318.
16 宁玲, 梁静, 钟长江, 等.广东印刷, 2017(3), 41.
17 Thomas M, Sonia S N, Thierry B. Journal of Nanoparticle Research, 2019, 21(6), 116.
18 Zhao K, Liu Y, Zhang T, et al. In: 18th International Conference on Electronic Packaging Technology, Harbin, 2017, pp. 1497.
19 Zhang X M, Yang X Y, Wang B. International Journal of Adhesion and Adhesives, 2021, 105, 102785.
20 Meng D R, Wang L M, Zhang J G, et al. In: Materials Science Forum. Switzerland, 2017, pp. 898.
21 Huang Y, Wu F S, Zhou Z, et al. Nanotechnology, 2020, 31(17), 175601.
22 姚瑶. 基于镀银铜粉填料的高导电复合材料的制备与性能研究.硕士学位论文, 电子科技大学, 2020.
23 李玉虎, 刘志宏, 刘付朋, 等. 中国专利, CN103949635 B, 2016.
24 刘成. 贵金属, 2009, 30(4), 25.
25 Jung D S, Li H M, Kang Y C, et al. Journal of Colloid and Interface Science, 2011, 2(364), 574.
26 陆伟华, 邵玮, 黄建.中国专利, CN106835048 A, 2017.
27 张小敏, 李起龙, 杜海涛, 等. 高校化学工程学报, 2020, 34(4), 1069.
28 汪星华, 张秋敏, 李明, 等.电镀与涂饰, 2019, 39(10), 655.
29 Liu P, Wang P, Deng Y Q, et al. In: IOP Conference Series: Earth and Environmental Science. Xi'an, 2019, pp. 022068.
30 Liu Y J, Yu Y T, Zhao X M. The Journal of the Textile Institute, 2020, 112(9), 1324.
31 魏昂, 郑泽军, 位威. 中国专利, CN109852146 A, 2019.
32 Alexander I T, Olga A L, Alexander M V, et al. Colloids and Surfaces A, 2019, 577, 500.

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