Abstract: With the progress of modern science and technology, demands for high-speed operation of electronic equipment make electronic devices develop in the direction of lightweight, miniaturization and integration. Electromagnetic interference (EMI) generated by different devices adversely affects the performance of electronic system, and human health may be harmed after long time exposure to electromagnetic radiation. Therefore, the suppression or mitigation of undesirable electromagnetic interference has become an important research direction in the field of materials science. In this review, characteristics, composition and shielding mechanism of different electromagnetic shielding materials, and research progress and applications of electromagnetic shielding technology are summarized.
1 Wan Y, Zhu P, Yu S, et al. Carbon, 2017, 122, 74. 2 Stam R, Yamaguchi-Sekino S. Industrial Health, 2018, 56(2), 96. 3 孙天, 赵晓明. 纺织科学与工程学报, 2018, 35(2), 118. 4 Geetha S, Kumar K K S, Rao C R K, et al. Applied Polymer, 2009, 112(4), 2073. 5 Chung D. Journal of Materials Endineering and Performance, 2000, 9(3), 350. 6 Iqbal A, Sambyal P, Koo C M. Advanced Functional Materials, 2020, DOI:10.1002/adfm.202000883. 7 Xiong D, Li X, Bai Z, et al. Small, 2018, DOI:10.1002/smll.201703419. 8 Gonza'Lez M, Pozuelo J, Baselga J. Chemical Record, 2018, 18, 1. 9 宋斌, 黄月文, 祖伟皓, 等. 广州化学, 2021, 46(1), 1. 10 Chen H C, Lee K C, Lin J H, et al. Journal of Materials Processing Technology, 2007, 192-193, 549. 11 Jyoti J, Basu S, Singh B P, et al. Composites Part B: Engineering, 2015, 83, 58. 12 Trivedi D C, Srivivasan S. Journal of Materials Science Letters, 1989, 8, 709. 13 Trivedi D C, Dhawan S K. Polymers for Advanced Technologies, 1993, 4, 335. 14 Geetha S, Kumar K K S, Trivedi D C. Composites Science and Technology, 2005, 65, 973. 15 Dhawan S K, Trivedi D C. Bulletin of Materials Science, 1993, 16, 371. 16 Pomposo J A, Rodriguez J, Grande H. Synthetic Metals, 1999, 104(2), 107. 17 Kaynak A. Materials Research Bulletin, 1996, 31(7), 845. 18 Calleja F J B B, Bayer R R, Ezquerra T A. Journal of Materials Science, 1988, 23, 1411. 19 Mao Y, Zhang S, Wang W, et al. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2008, 558, 538. 20 Wenderoth K, Petermann J, Kruse K D, et al. Polymer Composites, 1989, 10, 52. 21 Baker Z Q, Abdelazeez M K, Zihlif A M. Journal of Materials Science, 1988, 23, 2995. 22 王一龙, 官建国, 邵寒梅. 硅酸盐学报, 2008 (3), 301. 23 朱晓云. 电磁屏蔽用片状银包铜粉的制备技术研究, 中国机械工程学会表面工程分会, 2006. 24 tefečka M, Kandoh M, Matsuo H, et al. Journal of Materials Science, 2004, 39(6), 2215. 25 Yang Y, Gupta M C, Dudley K L, et al. Nano Letters, 2005, 5(11), 2131. 26 Xu Z, Hao H. Journal of Alloys and Compounds, 2014, 617, 207. 27 Chen Z, Xu C, Ma C, et al. Advanced Materials, 2013, 25, 1296.