Please wait a minute...
材料导报  2019, Vol. 33 Issue (Z2): 501-504    
  金属与金属基复合材料 |
键合丝键合界面研究进展
彭成, 梁爽, 黄福祥, 钟明君, 冉小杰
重庆理工大学材料科学与工程学院,重庆 400054
Research Progress on Bonding Interface of Bonded Wire
PENG Cheng, LIANG Shuang, HUANG Fuxiang, ZHONG Mingjun, RAN Xiaojie
College of Material Science and Engineering, Chongqing University of Technology, Chongqing 400054
下载:  全 文 ( PDF ) ( 2191KB ) 
输出:  BibTeX | EndNote (RIS)      
摘要 采用引线键合技术对集成电路进行封装时,键合丝与Al焊盘存在异质界面问题,对电子器件的使用性能有很大的影响。本文综述了键合参数、界面金属间化合物(IMC)演变行为及工作环境等方面对界面键合强度和可靠性影响的研究进展,并展望了未来发展前景。
服务
把本文推荐给朋友
加入引用管理器
E-mail Alert
RSS
作者相关文章
彭成
梁爽
黄福祥
钟明君
冉小杰
关键词:  键合丝  界面  金属间化合物(IMC)  键合强度  可靠性    
Abstract: When the integrated circuit is packaged by wire bonding technology, the bonding wire and the Al pad have a heterointerface problem, which has a great influence on the performance of the electronic device. In this paper, the research progress of bonding parameters, interfacial intermetallic compound (IMC) evolution behavior and working environment on interface bonding strength and reliability is reviewed, and the deve-lopment of bonding interface research methods are prospected.
Key words:  bonding wire    interface    intermetallic compound (IMC)    bonding strength    reliability
               出版日期:  2019-11-25      发布日期:  2019-11-25
ZTFLH:  TG146  
基金资助: 国家重点研发计划(2016YFB0402602)
通讯作者:  hfx@cqut.edu.cn   
作者简介:  彭成,2017年6月毕业于重庆理工大学,获得工学学士学位。现为重庆理工大学材料科学与工程学院硕士研究生,在黄福祥教授的指导下进行研究。目前主要研究领域为先进功能材料的理论研究。
黄福祥,重庆理工大学材料科学与工程学院教授、硕士研究生导师。1985年7月本科毕业于重庆大学材料科学与工程学院,2003年7月获得清华大学材料学专业博士学位。近年来,主要研究的领域涉及金属功能材料、材料计算学、材料表面与界面分析等,在国内外重要刊物如Scripta Materialia等发表论文120余篇,发表论文共被他人引用200余次。
引用本文:    
彭成, 梁爽, 黄福祥, 钟明君, 冉小杰. 键合丝键合界面研究进展[J]. 材料导报, 2019, 33(Z2): 501-504.
PENG Cheng, LIANG Shuang, HUANG Fuxiang, ZHONG Mingjun, RAN Xiaojie. Research Progress on Bonding Interface of Bonded Wire. Materials Reports, 2019, 33(Z2): 501-504.
链接本文:  
http://www.mater-rep.com/CN/  或          http://www.mater-rep.com/CN/Y2019/V33/IZ2/501
1 田春霞.稀有金属,2003,27(6),782.
2 陈永泰,谢明,王松,等.贵金属,2014(3),66.
3 钟明君,黄福祥,阮海光,等.材料导报,2017,31(专辑30),99.
4 康菲菲,吴永瑾,孔建稳,等.贵金属,2017,38(4),81.
5 刘长宏.面向引线键合工艺的质量影响因素与规律的分析.硕士学位论文,广东工业大学,2008.
6 Feng J, Zhang W, Jiang W. Physical Review B,2005,72(11),115423.
7 李松.超声键合界面金属学行为研究.硕士学位论文,哈尔滨工业大学,2006.
8 李军辉,谭建平,韩雷,等.中南大学学报(自然科学版),2005,36(1),87.
9 Wu J, Rockey T, Yauw O, et al. In:Conference Record of the 2012 IEEE 14th Electronics Packaging Technology Conference. Singapore,2012,pp.499.
10 Lee T K, Breach C D, Chong W L, et al. In: Conference Record of the 2012 IEEE 13th International Conference on Electronic Packaging Technology & High Density Packaging. Guilin,2012,pp.244.
11 Wu Jie, Yang J H, Oranna Yauw, et al. In: Conference Record of the 2014 IEEE 16th Electronics Packaging Technology Conference. Singapore,2014,pp.472.
12 杭春进.引线键合铜球可变形性在线测量及Cu/Al界面反应研究.博士学位论文,哈尔滨工业大学,2008.
13 李明雨,计红军,关经纬,等.电子工艺技术,2006,27(3),125.
14 Jeng Y R, Chiu S M, Huang P Y, et al. IEEE Transactions on Electronics Packaging Manufacturing,2010,33(1),65.
15 Rodwell R, Worrall D A. Hybrid Circuits,1985,34(7),67.
16 Wu Fengshun, Wu Yiping, et al. In: Conference Record of the 2005 IEEE 6th International Conference on Electronic Packaging Technology. Shenzhen,2005.
17 计红军.超声楔形键合界面连接物理机理研究.博士学位论文,哈尔滨工业大学,2008.
18 王福亮,韩雷,钟掘.机械工程学报,2007,43(3),107.
19 薛瑞.超声功率和键合压力对金丝热超声键合质量的影响研究.硕士学位论文,电子科技大学,2015.
20 刘长宏,高健,陈新,等.半导体技术,2006,31(11),828.
21 Kaestle C, Syed Khaja A, Reinhardt A, et al. In: Conference Record of the 2013 IEEE 36th International Spring Seminar on Electronics Techno-logy. Romania,2013,pp.79.
22 王美荣.硅谷,2008(18),37.
23 Rooney D T, Nager D P, Geiger D, et al. Microelectronics Reliability,2005,45(2),379.
24 Li M, Li C, Wang F, et al. Journal of Alloys and Compounds,2004,385(1-2),199.
25 Xu H, Liu C, et al. Intermetallics,2011,19,1808.
26 王慧君,龚冰,崔洪波.电子工艺技术,2015(4),214.
27 Michael N, Kang S H, Chul U, et al. In: Conference Record of the 2009 IEEE 59th Electronic Components & Technology Conference. San Diego,2009,pp.943.
28 Cho J S, Jeong H S, Moon J T, et al. In: Conference Record of the 2009 IEEE 59th Electronic Components & Technology Conference. San Diego,2009,pp.1569.
29 肖剑.引线材料与金属间互化物的关联性研究.硕士学位论文,电子科技大学,2014.
30 Shah A, Rockey T, Xu H, et al. In: Conference Record of the 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). Singapore,2015,pp.1.
31 Murray J L. Metallurgical Reviews,1985,30(1),211.
32 Xu H, Liu C, Silberschmidt V V, et al. Microelectronics Reliability,2011,51(1),113.
33 张滨海.IC封装铜线键合Cu/Al界面金属间化合物的性能研究.硕士学位论文,复旦大学,2010.
34 徐慧.铜及金丝与铝合金焊盘键合的金属间化合物生长和可靠性.硕士学位论文,哈尔滨工业大学,2006.
35 杨庆龄,陈奕仪,吴幸,等.物理学报,2015,64(21),1.
36 Fu S W, Lee C C. In: Conference Record of the 2016 IEEE 66th Electronic Components & Technology Conference. Las Vegas,2016,pp.648.
37 Choi M R, Kim H G, Lee T W, et al. Microelectronics Reliability,2015,55,2306.
38 陈华.单晶铜丝在半导体器件封装中的打线键合性能研究.硕士学位论文,兰州理工大学,2005.
39 Toyozawa K, Fujita K, Minamide S, et al. IEEE Transactions on Components Hybrids & Manufacturing Technology,1990,13(4),667.
40 Hsueh H W, Hung F Y, Lui T S, et al. Microelectronics Reliability,2014,54(11),2564.
41 陈国海,刘豫东,马莒生.稀有金属材料与工程,2005,34(1),143.
42 Xu H, Liu C, Silberschmidt V V, et al. Scripta Materialia,2011,65(7),642.
43 Soestbergen M V, Mavinkurve A, Zaal J J M, et al. In: Conference Record of the 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). Las Vegas,2016,pp.774.
44 Jang Y C, Park S Y, Kim H D, et al. In: Conference Record of the 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). Singapore,2014,pp.704.
45 Lue M H, Huang C T, Huang S T, et al. Journal of Electronic Materials,2004,33(10),1111.
[1] 张学元, 吕春, 张道明, 王丽, 李扬. 稻草纤维在轻骨料混凝土中的增韧性能及劈裂抗拉强度预测模型[J]. 材料导报, 2020, 34(2): 2034-2038.
[2] 岳慧芳, 冯可芹, 庞华, 张瑞谦, 李垣明, 吕亮亮, 赵艳丽, 袁攀. 粉末冶金法烧结制备SiC/Zr耐事故复合材料的研究[J]. 材料导报, 2019, 33(z1): 321-325.
[3] 薛艺, 田青超. 硬质合金切削刀具研究进展[J]. 材料导报, 2019, 33(z1): 353-357.
[4] 薛秀丽, 曾超峰, 王世斌, 李林安, 王志勇. 溶剂对PMMA基底上金属薄膜形貌的影响[J]. 材料导报, 2019, 33(z1): 412-415.
[5] 刘新灵, 陶春虎, 王天宇. 夹杂物形状对夹杂/基体界面应力应变分布的影响[J]. 材料导报, 2019, 33(z1): 436-439.
[6] 王婷, 张守海, 蹇锡高, 刘乾, 刘泽元. 界面聚合法合成含杂萘酮联苯结构共聚芳酯[J]. 材料导报, 2019, 33(z1): 495-498.
[7] 邓云华, 陶军, 马旭颐. TC4钛合金刚性拘束热自压扩散连接接头疲劳性能分析[J]. 材料导报, 2019, 33(9): 1449-1454.
[8] 蔺宏涛, 江海涛, 王怡嵩, 张坤, 张贵华. 6016-T4铝合金与镀锌IF钢搅拌摩擦焊接头的组织与性能[J]. 材料导报, 2019, 33(9): 1443-1448.
[9] 李雪换, 底月兰, 王海斗, 李国禄, 董丽虹, 马懿泽. 基于内聚力模型的热障涂层失效行为研究[J]. 材料导报, 2019, 33(9): 1500-1504.
[10] 翟恒来, 齐宁, 孙逊, 张翔宇, 樊家铖. 一种新型纳米SiO2降压增注剂的制备与评价[J]. 材料导报, 2019, 33(6): 975-979.
[11] 邱博, 邢书明, 董琦. 颗粒增强金属基复合材料界面结合强度的表征:理论模型、有限元模拟和实验测试[J]. 材料导报, 2019, 33(5): 862-870.
[12] 闫民杰, 刘梁森, 陈莉, 刘丽研, 荆妙蕾, 徐志伟, 姜亚明, 傅宏俊. 基于碳纳米管界面改性的碳纤维复合材料抗γ辐射性能研究[J]. 材料导报, 2019, 33(24): 4174-4180.
[13] 屈伟, 范同祥. 金属/陶瓷润湿性的实验表征和理论预测研究进展[J]. 材料导报, 2019, 33(21): 3606-3612.
[14] 陈豪, 肖清泉, 谢泉, 王坤, 史娇娜. 近红外Mg2Si/Si异质结光电二极管的结构设计与仿真[J]. 材料导报, 2019, 33(20): 3358-3362.
[15] 宁洪龙, 朱镇南, 蔡炜, 魏靖林, 周尚雄, 陶瑞强, 陈建秋, 刘贤哲, 姚日晖, 彭俊彪. 喷墨打印中的界面润湿问题[J]. 材料导报, 2019, 33(19): 3236-3241.
[1] Dongyong SI, Guangxu HUANG, Chuanxiang ZHANG, Baolin XING, Zehua CHEN, Liwei CHEN, Haoran ZHANG. Preparation and Electrochemical Performance of Humic Acid-based Graphitized Materials[J]. Materials Reports, 2018, 32(3): 368 -372 .
[2] Bingwei LUO,Dabo LIU,Fei LUO,Ye TIAN,Dongsheng CHEN,Haitao ZHOU. Research on the Two Typical Infrared Detection Materials Serving at Low Temperatures: a Review[J]. Materials Reports, 2018, 32(3): 398 -404 .
[3] Huimin PAN,Jun FU,Qingxin ZHAO. Sulfate Attack Resistance of Concrete Subjected to Disturbance in Hardening Stage[J]. Materials Reports, 2018, 32(2): 282 -287 .
[4] Siyuan ZHOU,Jianfeng JIN,Lu WANG,Jingyi CAO,Peijun YANG. Multiscale Simulation of Geometric Effect on Onset Plasticity of Nano-scale Asperities[J]. Materials Reports, 2018, 32(2): 316 -321 .
[5] Xu LI,Ziru WANG,Li YANG,Zhendong ZHANG,Youting ZHANG,Yifan DU. Synthesis and Performance of Magnetic Oil Absorption Material with Rice Chaff Support[J]. Materials Reports, 2018, 32(2): 219 -222 .
[6] Ninghui LIANG,Peng YANG,Xinrong LIU,Yang ZHONG,Zheqi GUO. A Study on Dynamic Compressive Mechanical Properties of Multi-size Polypropylene Fiber Concrete Under High Strain Rate[J]. Materials Reports, 2018, 32(2): 288 -294 .
[7] WANG Tong, BAO Yan. Advances on Functional Polyacrylate/Inorganic Nanocomposite Latex for Leather Finishing[J]. Materials Reports, 2017, 31(1): 64 -71 .
[8] WANG Wenjin, WANG Keqiang, YE Shenjie, MIAO Weijun, CHEN Zhongren. Effect of Asymmetric Block Copolymer of PI-b-PB on Phase Morphology and Properties of IR/BR Blends[J]. Materials Reports, 2017, 31(2): 96 -100 .
[9] HUANG Dajian, MA Zonghong, MA Chenyang, WANG Xinwei. Preparation and Properties of Gelatin/Chitosan Composite Films Enhanced by Chitin Nanofiber[J]. Materials Reports, 2017, 31(8): 21 -24 .
[10] WU Tao, MAO Lili, WANG Haizeng. Preparation and Defluoridation Performance of Mg/Fe-LDHO/PES Membranous Adsorbent[J]. Materials Reports, 2017, 31(14): 26 -30 .
Viewed
Full text


Abstract

Cited

  Shared   
  Discussed