Abstract: When the integrated circuit is packaged by wire bonding technology, the bonding wire and the Al pad have a heterointerface problem, which has a great influence on the performance of the electronic device. In this paper, the research progress of bonding parameters, interfacial intermetallic compound (IMC) evolution behavior and working environment on interface bonding strength and reliability is reviewed, and the deve-lopment of bonding interface research methods are prospected.
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