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材料导报  2021, Vol. 35 Issue (14): 14156-14160    https://doi.org/10.11896/cldb.20050139
  金属与金属基复合材料 |
合金元素对Cu/Sn-/Cu回流焊焊点界面微观结构及剪切性能的影响
杨平1,2, 毛育青1,2,*, 李芊芃2, 何良刚2, 柯黎明2
1 南昌航空大学无损检测技术教育部重点实验室, 南昌 330063
2 南昌航空大学轻合金加工科学与技术国防重点学科实验室, 南昌 330063
Effects of Alloy Elements on Microstructure and Shearing Properties of Cu/Sn-/Cu Reflow Soldering Joints
YANG Ping1,2, MAO Yuqing1,2,*, LI Qianpeng2, HE Lianggang2, KE Liming2
1 Key Laboratory of Nondestructive Testing of Ministry of Education, Nanchang Hangkong University, Nanchang 330063, China
2 National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology, Nanchang Hangkong University, Nanchang 330063, China
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摘要 选用Sn64Bi35Ag1、Sn64.7Bi35Ag0.3和Sn99Ag0.3Cu0.7三种不同的钎料进行回流焊焊接试验,研究高Bi元素、低Ag元素钎料及低Ag钎料对Sn基钎料焊点微观组织及剪切性能的影响。结果表明:各焊点界面处均生成了一层扇贝状的Cu6Sn5金属间化合物,在含Bi元素的钎料焊点中,Bi元素在焊点界面及内部聚集,导致界面处金属间化合物层的厚度增加,大量富Bi相呈脆性,降低钎料中的Ag含量对焊点中Bi元素的富集现象有减弱作用。Sn99Ag0.3Cu0.7钎料焊点界面处的金属间化合物层厚度最小,且焊点内部形成了细小的Ag3Sn相颗粒,共晶组织呈均匀分布,使得焊点剪切性能最优,其剪切强度达20.4 MPa。
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杨平
毛育青
李芊芃
何良刚
柯黎明
关键词:  合金元素  Sn基钎料  回流焊  显微组织  剪切性能    
Abstract: Three different solders, Sn64Bi 35Ag1, Sn64.7Bi 35Ag0.3 and Sn99Ag 0.3Cu0.7, were selected for the reflow welding test. The effects of high Bi, low Ag and low Ag solders on microstructure and tensile shear properties of Sn-based solder joints were investigated. The results show that a scallop-like Cu6Sn5 intermetallic compound is formed at the interface of each solder joint. In the solder joint containing Bi, the accumulation of Bi at the interface and inside of the solder joint leads to the increase of the thickness of the intermetallic compound layer at the interface, and a large number of Bi-rich phases are brittle. The decrease of Ag content in the solder weakens the enrichment of Bi in the solder joint. The thickness of intermetallic compound layer at the interface of Sn99Ag0.3Cu0.7 solder joint is the smallest, and fine Ag3Sn phase particles are formed in the solder joint. The eutectic structure is uniformly distributed, which makes the shear performance of the solder joint optimal, and the shear strength reaches 20.4 MPa.
Key words:  alloy elements    Sn-based solders    reflow soldering    microstructure    shearing properties
               出版日期:  2021-07-25      发布日期:  2021-08-03
ZTFLH:  TG453.9  
基金资助: 无损检测技术教育部重点实验室开放基金(EW201703508)
通讯作者:  * maoyuqing-8888@163.com   
作者简介:  杨平,就读于南昌航空大学。主要从事搅拌摩擦焊和电子封装方面的研究。
毛育青,南昌航空大学博士、副教授、硕士研究生导师。2012年9月至2017年3月,在西北工业大学凝固技术国家重点实验室获得材料加工工程专业工学博士学位,毕业后在南昌航空大学任教。以第一作者在国内外学术期刊上发表论文40余篇,申请国家发明专利3项,其中授权2项。同时,担任多个学术期刊的审稿人。研究工作主要围绕国家重点发展的先进金属材料先进连接技术加工、金属基复合材料加工及金属材料增材制造技术等工艺及其组织性能控制的基础理论和应用研究,目前主持包括国家自然科学基金、江西省自然科学基金、江西省科技厅项目等科研项目15项。
引用本文:    
杨平, 毛育青, 李芊芃, 何良刚, 柯黎明. 合金元素对Cu/Sn-/Cu回流焊焊点界面微观结构及剪切性能的影响[J]. 材料导报, 2021, 35(14): 14156-14160.
YANG Ping, MAO Yuqing, LI Qianpeng, HE Lianggang, KE Liming. Effects of Alloy Elements on Microstructure and Shearing Properties of Cu/Sn-/Cu Reflow Soldering Joints. Materials Reports, 2021, 35(14): 14156-14160.
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http://www.mater-rep.com/CN/10.11896/cldb.20050139  或          http://www.mater-rep.com/CN/Y2021/V35/I14/14156
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