1 Engineering College, Shantou University, Shantou 515063, Guangdong, China 2 Key Laboratory of Intelligent Manufacturing of Ministry of Education, Shantou University, Shantou 515063, Guangdong, China
Abstract: The flexible circuits can solve the problem that traditional metal conductors are easy to fail when subjected to mechanical stress, which makes the deformation and movement of the flexible robot no longer constrained by the traditional metal conductor. In this work, a new type of flexible circuit is designed by combining material structure design with circuit design, using the mechanism that flexible materials form different information channels under the action of force. The circuit is a complex mixture of flexibe materials and conductive materials. In the initial state, there is no information path inside the mixture, which can be deformed and bonded into the corresponding information path by manual means to form a variety of logic gates such as ‘AND’‘OR’‘XOR’ and so on. The input of the logic gate is force, and the output is displayed with the ‘on and off’ state of an LED light. Finite element simulations and experiments show that flexible circuits can realize the desired logic function robustly. In the future, such flexible circuits could be embedded in robots, sensors or drivers, which is expected to enable these devices to generate decision-making intelligence that is adapted to the environment.
1 Zhou Ji. Merging of metamaterials and conventional, Science Press, China, 2016. (in Chinese). 周济. 超材料与常规材料的融合, 科学出版社, 2016. 2 Yu X, Zhou J, Liang H, et al. Progress in Materials Science, 2018, 94, 114. 3 Kuindersma S, Deits R, Fallon M, et al. Autonomous Robots, 2016, 40(3), 429. 4 Nelson G, Saunders A. Humanoid robotics: a reference, Springer, 2018, pp.1. 5 Ren L, Li B, Wei G, et al. iScience, 2021, 24(9), 103075. 6 Stephen C, Carmel M, Philip L D, et al. Extreme Mechanics Letters, 2018, 22, 51. 7 Kim S, Laschi C, Trimmer B. Trends in Biotechnology, 2013, 31(5), 287. 8 Martinez R V, Branch J L, Fish C R, et al. Advanced Materials, 2013, 25(2), 205. 9 Pfeifer R, Lungarella M, Iida F. Communications of the ACM, 2012, 55(11), 76. 10 Whitesides G M. Angewandte Chemie International Edition, 2018, 57(16), 4258. 11 Park S, Vosguerichian M, Bap Z. Nanoscale, 2013, 5(5), 1727. 12 Lipomi D J, Bao Z. Energy & Environmental Science, 2011, 4(9), 3314. 13 Sekitani T, Someya T. Advanced Materials, 2010, 22(20), 2228. 14 Benight S J, Wang C, Tok J B H, et al. Progress in Polymer Science, 2013, 38(12), 1961. 15 Xiang Y, Li T, Suo Z, et al. Applied Physics Letters, 2005, 87(16), 161910. 16 Li T, Suo Z. International Journal of Solids and Structures, 2006, 43(7-8). 2351. 17 Harris K D, Elias A L, Chung H J. Journal of Materials Science, 2016, 51(6). 2771. 18 Rogers J A, Someya T, Huang Y. Science, 2010, 327(5973), 1603. 19 Zhu J, Dexheimer M, Cheng H. npj Flexible Electronics, 2017, 1(1), 1. 20 Nassar J M, Rojas J P, Hussain A M, et al. Extreme Mechanics Letters, 2016, 9, 245. 21 Huang S, Liu Y, Zhao Y, et al. Advanced Functional Materials, 2019, 29(6), 1805924. 22 Zhang Y, Yan Z, Nan K, et al. Proceedings of the National Academy of Sciences, 2015, 112(38), 11757. 23 Rogers J, Huang Y, Schmidt O G, et al. Mrs Bulletin, 2016, 41(2), 123. 24 Xu B, Chen D, Hayward R C. Advanced Materials, 2014, 26(25). 4381. 25 Nick Z H, Tabor C E, Harne R L. Extreme Mechanics Letters, 2020, 40, 100871. 26 Heo H, Li S, Bao H, et al. Advanced Engineering Materials, 2019, 21(6), 1900225. 27 El Helou C, Buskohl P R, Tabor C E, et al. Nature Communications, 2021, 12(1), 1. 28 Mei T, Meng Z, Zhao K, et al. Nature Communications, 2021, 12(1), 1.