废印刷电路板非金属粉负载二氧化硅杂化填料的制备及其在不饱和聚酯中的应用

doi:10.11896/j.issn.1005-023X.2018.02.024

《材料导报》期刊社

2018, Vol. 32

Issue (2): 278-281 https://doi.org/10.11896/j.issn.1005-023X.2018.02.024

物理材料研究｜材料

废印刷电路板非金属粉负载二氧化硅杂化填料的制备及其在不饱和聚酯中的应用

胡德超,贾志欣,钟邦超,董焕焕,丁勇,罗远芳,贾德民

华南理工大学材料科学与工程学院,广东省高性能与功能高分子材料重点实验室,广州 510640

Preparation of WPCBP/SiO₂ Hybrid Filler and Its Application in Unsaturated Polyester Resin

Dechao HU,Zhixin JIA,Bangchao ZHONG,Huanhuan DONG,Yong DING,Yuanfang LUO,Demin JIA

School of Materials Science and Engineering, Guangdong Key Laboratory of High Performance and FunctionalPolymer Materials, South China University of Technology, Guangzhou 510640

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摘要

为增强废印刷电路板非金属粉(WPCBP)与聚合物基体之间的界面结合作用,采用溶胶-凝胶法在WPCBP表面原位负载了一层纳米二氧化硅粒子(SiO₂),制备了一种新型的WPCBP-SiO₂杂化填料。SEM、TGA和FTIR证明SiO₂通过化学键成功负载到了杂化填料的表面。采用含双键的界面改性剂对杂化填料进行改性后,应用于不饱和聚酯树脂基体,探讨了未改性杂化填料及表面改性杂化填料对不饱和聚酯复合材料的力学性能、界面结合作用和热稳定性能的影响。结果表明,新型的杂化填料WPCBP-SiO₂能够与不饱和聚酯基体形成强的界面结合作用,显著提高不饱和聚酯复合材料的力学性能和热稳定性能,且表面改性后复合材料的各项性能得到进一步提高。

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	胡德超
	贾志欣
	钟邦超
	董焕焕
	丁勇
	罗远芳
	贾德民

关键词: 杂化填料废印刷电路板非金属粉不饱和聚酯树脂力学性能补强机理热稳定性

Abstract:

To strengthen the interfacial interaction between waste printed circuit boards powders (WPCBP) and polymer matrix, WPCBP was immobilized a layer of SiO₂ nanoparticles to form a novel WPCBP-SiO₂ hybrid filler by sol-gel method. SEM, TGA and FTIR suggested that SiO₂ nanoparticles were chemically bonded onto the surface of WPCBP. Then WPCBP-SiO₂ hybrid filler was modified with a silane coupling agent and incorporated in unsaturated polyester resin (UPE) matrix. The effect of WPCBP-SiO₂ hybrid filler on mechanical properties, interfacial bonding and thermal stability of UPE composites were comprehensively explored. It has been confirmed that WPCBP-SiO₂ hybrid filler could form a strong interfacial interaction with polymer matrix, and markedly enhance the mechanical properties and thermal stability of UPE composites. Besides, the modification of hybrid filler give further improvements of UPE composites.

Key words: hybrid filler WPCBP unsaturated polyester resin mechanical property reinforcing mechanism thermal stability

出版日期: 2018-01-25 发布日期: 2018-01-25

ZTFLH:

TQ327

基金资助: 广东省应用型科技研发专项资金(2015B020237004)

引用本文:

胡德超,贾志欣,钟邦超,董焕焕,丁勇,罗远芳,贾德民. 废印刷电路板非金属粉负载二氧化硅杂化填料的制备及其在不饱和聚酯中的应用[J]. 《材料导报》期刊社, 2018, 32(2): 278-281.
Dechao HU,Zhixin JIA,Bangchao ZHONG,Huanhuan DONG,Yong DING,Yuanfang LUO,Demin JIA. Preparation of WPCBP/SiO₂ Hybrid Filler and Its Application in Unsaturated Polyester Resin. Materials Reports, 2018, 32(2): 278-281.

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https://www.mater-rep.com/CN/10.11896/j.issn.1005-023X.2018.02.024 或 https://www.mater-rep.com/CN/Y2018/V32/I2/278

图1 WPCBP-SiO2杂化填料的制备示意图

图2 (a—c)WPCBP和(d—f)WPCBP-SiO2杂化填料的扫描电镜图

图3 WPCBP、WPCBP-SiO2和m-WPCBP-SiO2的FTIR曲线

图4 WPCBP和WPCBP-SiO2的TGA和DTG曲线

图5 (a,b)WPCBP, (c,d)WPCBP-SiO2和(e,f) m-WPCBP-SiO2填充的UPE复合材料的扫描电镜图

表1 UPE及UPE复合材料的力学性能

图6 UPE复合材料的补强机理示意图

图7 UPE和UPE复合材料的TGA曲线

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