To strengthen the interfacial interaction between waste printed circuit boards powders (WPCBP) and polymer matrix, WPCBP was immobilized a layer of SiO2 nanoparticles to form a novel WPCBP-SiO2 hybrid filler by sol-gel method. SEM, TGA and FTIR suggested that SiO2 nanoparticles were chemically bonded onto the surface of WPCBP. Then WPCBP-SiO2 hybrid filler was modified with a silane coupling agent and incorporated in unsaturated polyester resin (UPE) matrix. The effect of WPCBP-SiO2 hybrid filler on mechanical properties, interfacial bonding and thermal stability of UPE composites were comprehensively explored. It has been confirmed that WPCBP-SiO2 hybrid filler could form a strong interfacial interaction with polymer matrix, and markedly enhance the mechanical properties and thermal stability of UPE composites. Besides, the modification of hybrid filler give further improvements of UPE composites.
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